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The understanding and controlling of semiconductor process variation is crucial to the performance, functionality and reliability of modern ICs. Due to the complex fabrication process involving hundreds of processing steps, the analysis of the sources of variability is a non-trivial task. In this paper, a novel, simple-to-implement procedure named Hierarchical Median Polish is proposed. The method...
To realize an intracellular contact between nanoelectrodes and cells, a sufficient small electrode diameter is needed [1]. A sacrificial layer process developed by the Fraunhofer IMS using deep reactive ion etching and atomic layer deposition [2] is varied. A double hard mask technique is used to taper structures in a sacrificial layer and thereby the nanoelectrodes' diameter. The principles and evaluation...
An analytical model for the thin-film silicon-on-insulator pin-diode leakage current is presented. Particularly the back-gate potential influence on the leakage current is addressed. The two-dimensional Poisson equation is simplified and then solved including the influence of the back-gate potential. Subsequently the analytical model is verified by comparison with numerical simulation and measurements...
The level of security provided by physically unclonable functions (PUFs) strongly depends on the unpredictability of its challenge-response behavior. Systematic variation in the properties of a PUF might introduce correlations in the output bits. The mutual dependence of response bits is typically not detected by conventional methods, thus leaving the PUF vulnerable to prediction attacks. New methods...
Passive components like capacitors for harsh environments become more and more important, e. g. in the field of deep drilling, aerospace or in the automotive industry. They have to withstand temperatures up to 300 °C with a good performance concerning leakage current, breakdown voltage and capacitance density. The whole process flow has to be CMOS-compatible in order to offer the possibility for CMOS-integration...
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