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Embedding technology enables miniaturisation of electric and electronic components together with improved reliability and thermal stability in harsh environment. This work investigates in form of single case studies the environmental performance from cradle-to-gate of two new designed and fabricated power modules for electric vehicle application with the method of the Sustainable Process Index (SPI)...
An entirely novel multilayer printed circuit board technology called EmPower allows embedding of chip components like power diodes, MOSFETs (Metal-oxide Semiconductor Field Effect Transistors) or IGBTs (Insulated Gate Bi-polar Transistors) at a significantly reduced module thickness into a glass fiber reinforced epoxy-resin layer built-up. One major concern is to handle the power loss within the given...
A novel double diode package (footprint D2PAK compatible) was designed, simulated, and fabricated using an innovative embedding process with electroplated large-area copper contact metallizations on both sides of the chip. The package was also experimentally characterized regarding the thermal performance using two different test methods: a test board and testing procedure according to a JEDEC standard...
Embedded components technology has launched its implementation in volume products demanding for highest miniaturization level. Smart phones have been the enablers for this new technology using the capabilities of embedded components. All along the European project EmPower has been the enabler for the development of a new embedding technology for high power components like MOSFET, IGBT and power diodes...
The knowledge of thermally induced strains created during the assembly in Printed Circuit Boards (PCB) is an important issue for electronic packages. In the assembly process, a thin silicon-chip is attached onto a copper foil. The curing of the adhesive is followed by the cooling down of the assembled structure to room temperature. The different properties of the involved materials and the geometry...
With the trend towards increasing complexity of Printed Circuit Boards (PCB), there has been considerable interest of investigation of the embedding process. The main focus has been set on the first step, the chip attachment by using an adhesive. Investigation of the adhesive thickness underneath the component by a numerical and an analytical model has been provided. The numerical model was produced...
During laminating of Printed Circuit Boards (PCB) bending stresses in the embedded components can be generated due to pressure induced by the resin flow over them, which can lead to their fracture. In addition, the cooling of the PCB after curing of the resin can be even more important for the loading of the component. Here, the different coefficients of thermal expansion of the involved materials...
The ongoing trend to further miniaturise electronic devices in Printed Circuit Board (PCB) technologies has pointed out the embedding of components as a principal design strategy. The reliability of the PCB relies on the functionality of the embedded components as well as on their structural integrity in order to survive the embedding process. In the present work, the biaxial strength of metallised...
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