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Embedding technology enables miniaturisation of electric and electronic components together with improved reliability and thermal stability in harsh environment. This work investigates in form of single case studies the environmental performance from cradle-to-gate of two new designed and fabricated power modules for electric vehicle application with the method of the Sustainable Process Index (SPI)...
An entirely novel multilayer printed circuit board technology called EmPower allows embedding of chip components like power diodes, MOSFETs (Metal-oxide Semiconductor Field Effect Transistors) or IGBTs (Insulated Gate Bi-polar Transistors) at a significantly reduced module thickness into a glass fiber reinforced epoxy-resin layer built-up. One major concern is to handle the power loss within the given...
There is no doubt that component embedding technology becomes more visible in handheld applications like smart phones and wearables. Embedding technology is pushing the miniaturization which is a must for the next big wave of Wearable Electronics and Internet of Things (IoT). The technology is going to System in Package and the question today is how far you can go in miniaturization and how much of...
A novel double diode package (footprint D2PAK compatible) was designed, simulated, and fabricated using an innovative embedding process with electroplated large-area copper contact metallizations on both sides of the chip. The package was also experimentally characterized regarding the thermal performance using two different test methods: a test board and testing procedure according to a JEDEC standard...
Embedded components technology has launched its implementation in volume products demanding for highest miniaturization level. Smart phones have been the enablers for this new technology using the capabilities of embedded components. All along the European project EmPower has been the enabler for the development of a new embedding technology for high power components like MOSFET, IGBT and power diodes...
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