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This paper introduces a thermal design method for 3D integration, using stacked thermal chips consisting of 100 polysilicon heaters in a 30 mm by 30 mm area on each chip to verify thermal models. For each heater, two levels of thermal load can be selected. Thermal effects from hot-spots in stacked chips were measured and verified in simulation results. Through this investigation, thermal models with...
In pursuing higher power density power electronic equipment, the copper clip bonding concept is one of the double-sided cooling approaches under investigation for power semiconductors. This paper presents a comprehensive thermal assessment of the copper clip concept by undertaking comparative studies on one bespoke copper-clip-bonded IGBT power module and a conventional wire-bonded counterpart. A...
Packages of commercial Gallium-Nitride power semiconductors present increasingly small dimensions to enable low parasitic inductance, increasing the heat flux density of the package and the challenges associated with their thermal management. This paper compares between Printed Circuit Boards and Direct Copper Bonded as substrates for a Gallium Nitride based half-bridge from a thermal and reliability...
An entirely novel multilayer printed circuit board technology called EmPower allows embedding of chip components like power diodes, MOSFETs (Metal-oxide Semiconductor Field Effect Transistors) or IGBTs (Insulated Gate Bi-polar Transistors) at a significantly reduced module thickness into a glass fiber reinforced epoxy-resin layer built-up. One major concern is to handle the power loss within the given...
The report describes the device power, created on the basis of the thermoelectric effect. The Peltier module of the generator type is used as the main element of the conversion of thermal energy into electrical energy. The structure of the generator system being developed, the results of testing the individual Peltier element and the test tests of the assembled power supply are described.
The work presents a new solution proposal to the cooling of concentrator photovoltaic cells. In our concept the microscale channels are integrated into the back surface metallization, the microscale channels are formed by electroplating copper around a photoresist channel pattern. This approach has the advantage that it has no restrictions regarding the solar cell material and technology. In this...
A demand for the high performance cooling technology with low operating power exists for the thermal management of the next generation power electronics, such as the IC inverter of electric vehicle. Boiling heat transfer is a promising candidate for the cooling technology because it can remove a large amount of heat from a heat generating device by phase change of the liquid. However, it is well known...
Three-dimensional (3D) electronic systems enable higher integration densities compared to their 2D counterparts, a gain required to meet the demands of future exa-scale computing, cloud computing, big data systems, cognitive computing, mobile devices and other emerging technologies. Through-silicon vias (TSVs) open a pathway to integrate electrical connections for signaling and power delivery through...
This paper presents a new approach in modelling a photovoltaic/thermal hybrid system based on Finite Element Method (FEM). Comsol Multiphysics, a commercial simulator based on FEM, and MATLAB simulation tools are used to implement this electro-thermal model. An optimization process takes place for the water back pipes regarding its material, shape and pipe diameter for maximum conversion efficiency...
Demand for compact high torque/power density electric machines necessitates the choice of an effective cooling system. The focus of this paper is to compare the steady-state thermal analysis of a naturally air-cooled conventional 8/6 SRM to the same motor with direct in-winding cooling system. The goal is to determine how much torque increase can be achieved by using direct cooling in the windings...
A 95 GHz long pulse gyrotron with water cooled copper magnet was assembled. The gyrotron operates at TE02 mode and second harmonic. A ∼1.8T magnetic field is produced by water cooled copper electro-magnet operating continuously in a 50% duty cycle of few seconds pulses. The magnet and the gyrotron have immediate turn on time when the cathode is worm. Initial results will be presented.
With the rapid development of three-dimensional (3D) integration technology, the through silicon via (TSV) approach has become the main trend of study. However the protrusion of cooper in TSV (TSV-Cu) due to the thermal mismatch of different materials in TSV structure imposes serious reliability problems. In this paper therefore focuses on the TSV-Cu protrusion effect under different annealing conditions...
Radio-frequency inductively coupled plasma (RF-ICP) technology has proven to be a viable means for continuous production of nanoparticles (NP), thanks to its distinctive features, such as high energy density, high chemical reactivity, high process purity, large plasma volume, long residence time of precursors and the high cooling rate (104-105 Ks−1) in the tail of the plasma, and its large number...
Direct water cooling of stator windings has been common since the early 1960s. In general these windings have performed well, although as would be expected in any liquid system involving many varied components, there have been problems with leaks, leaks both large and small, and copper oxide build-up. This paper will briefly summarize some basic stator winding design, operation and monitoring considerations...
Our task described in this paper is to prepare own experimental and innovative design of the cold crucibles. The measuring system which we created in our laboratory allows us an accurate evaluation of power losses. Due to measured power losses we are able to determine exact efficiency of induction system and verify previously prepared numerical simulations. Specifically, here we introduce two experimental...
Most all high power RF sources and components require liquid cooling, usually high purity water. Copper and associated braze alloys are susceptible to corrosion if the water contains impurities or modest levels of oxygen. Unfortunately, high purity water is not readily available in many locations, including developing countries, remote sites, and naval vessels. The U.S. Navy is funding development...
With the anticipated slow-down of Moore's Law in the near future, three-dimensional (3D) packaging of microelectronic structures would enable to further increase the integration density required to meet the forecasted demands of future exa-scale computing, cloud computing, big data systems, cognitive computing, mobile communicatoin and other emerging technologies. Through-silicon vias (TSVs) are a...
This paper evaluates boiling heat transfer performance on a lotus-type of porous copper attached on a heated surface. The experiments are performed under atmospheric and saturated pool conditions. The lotus porous medium has uni-directional pore structure and the average size of the pore hole is 0.4 mm. The porous plate of 1.0 mm or 2.0 mm in thickness is mechanically attached onto the heated surface...
This paper investigates the effects of underfill epoxy resin and silicone gel elastomer on packaging induced thermal mechanical stresses for a simplified double-sided cooling power package using finite element method. Visco-elastic and hyper-elastic constitutive models were used to simulate the non-linear material properties. The results were compared to the models with linear elastic material.
GaN power switches have better characteristics compared to the state-of-the-art Si power transistors. These devices offer high operating temperature and current densities, fast switching and low on-resistance. However, currently only a few producers offer technology of high voltage GaN transistors. Immaturity of this technology is the reason why experimental evaluation of GaN parameters must be performed...
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