The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Side reservoir can improve electromigration (EM) lifetime of copper interconnects. In this work, finite element method (FEM) simulations for interconnect structures with cathode end-of-line reservoir and side reservoir respectively have been conducted to study the side reservoir effects on EM lifetime. It is demonstrated that side location is most likely to have void failure and side reservoir can...
Highly dynamic DC-machines, used in low power applications, often contain ironless or so called bell shaped windings. Because there is no massive iron core to support the windings, one of the limiting factors for the torque of the machine is the force on the single wires of the copper weave. Therefore, the knowledge of the force distribution on the single wires could be a helpful design criterion...
This study presents a method to use copper nodules to induce dielectrophoresis force. It can be applied in biomedical cell capture. The capture electrode is a 3D interdigitated microelectrode and also can be used in electrical cell impedance measurement. No additional procedural is needed to form copper nodules. The process is easy, convenient, and the same as a normal 3D electrode manufacture.
This paper presents the relations between processing, microstructure and mechanical reliability of copper pillar bumps (CuPi). Two sets of samples were manufactured: Cu/SnAg and Cu/Ni/SnAg with diameters between 15 and 20 µm. From the microstructure point of view: at these dimensions and for simulated reflows, up to 5, intermetallic compounds (IMC) follow a classical power law with a time exponent...
One of the major topics of switched reluctance machines (SRMs) is how to reduce the acoustic noise and vibration without the decrease in efficiency. In this paper, a novel current profiling method is proposed to reduce the rms current while flatting the radial force sum to reduce the acoustic noise and vibration. The proposed method is adopted to the 18/12 SRM which has the competitive outer dimensions,...
The high frequency resonant current in coupler would inevitable results in interaction of electromagnetic force (EMF), leading to short service life, poor security and low reliability of wireless power transmission (WPT). It may be worse when electromagnetic shielding (EMS) materials are used. The mechanism and characteristics of the EMF on various EMS materials are revealed. Based on Lorentz force...
This paper proposes a novel DC-excited flux-modulated linear machine with new primary structure for utilizing amorphous core. Although amorphous core is regarded as a good candidate in high efficient electric machine, and being investigated for decades, it has not been widely used in electric machines yet. The key problem is the difficulty in slotting. For the new structure, the difficulty in slotting...
Although the area of flexible circuits is not new, current display and portable electronics consumer markets are driving device and packaging designs that will require increasingly higher robustness, especially as more devices are driven toward lightweight, wearable designs that enhance the personal IOT (Internet of Things) association. There will be an advantage for developers in flexible electronics...
Power electronic applications come along with very high requirements in terms of reliability. Thermal loadings stress whole electronic packages while powering the semiconductor and by environmental temperature changes. Direct copper bonding (DCB) substrates are widely used in electronic applications due to its high thermal conductivity performance. They consists of copper layers sintered onto an Al...
Levitation of a rotor within an electrostatically driven micromotor has been proposed as a method of overcoming the relatively large frictional resistance caused by contact friction. A novel arrangement in which the rotor is levitated by embedding it within the fringing fields of a pair of microwave cavities is described. The nature of the levitating system is a dynamic one, and requires no feedback...
In 1991, a game changing technique was introduced into the metal joining community. Patented in 1991 by The Welding Institute, the Friction Stir Welding (FSW) process has since transformed the way metal joining is being done. Since then, many industries have come to embrace the new joining technology due to its ease of operation and other numerous advantages it offers. Aside from the ease with which...
This study aims to optimally set the operational parameters of pulsed green laser welding with copper. Multi input parameters and critical-to-quality outputs were considered. The chosen inputs were power, pulse duration and pressured air flow, while the outputs were the maximum force handled by the welding joint and the penetration level of the laser weld. Design and analyses for single-response and...
Micromanipulation provides researchers a new way to fabricate complex structures through assembling small components, and it is also a useful tool for single cell manipulation. Many micromanipulation methods have been proposed, but only the few are capable of rotation of the micro targets. In this paper, we present a simple non-contact high-speed rotation method based on the local flow generated by...
Electrodynamic (ED) forces influencing upon lightning protection (LP) components in some typical LP system configurations and conditions are studied. These include: various angles between conductors, their finite lengths, round and flat bar cross-section, grid of conductors, various heights of conductor holders, placement of conductors above metallic cladding and reinforced concrete, various materials,...
With the Copper wire bonding already occupying majority of production lines, there are many significant factors continue to surface out. The Copper wire bonding has also becomes very susceptible to production variability of small leaded packages such as Thin Small Outline Package (TSOP). The TSOP utilizes thin and flimsy leadframes, causing a lot challenges at 2nd bond (stitch). The stitch bonding...
Afferent electrical stimulation is known to augment the effect of rehabilitative therapy through use-dependent cortical plasticity. Experiments pairing transcranial magnetic stimulation (TMS) with peripheral nerve stimulation (PNS) have shown a timing-dependent effect on motor evoked potential (MEP) amplitude suggesting that PNS applied in closed-loop (CL) mode could augment this effect through positive...
Ultrasonic heavy wire bonding is a commonly used technology to conduct electrical devices in power electronics. In order to facilitate powerful solutions combined with an increased efficiency, involving a material change from aluminum to copper wire as conductor material takes place in recent years. Due to the material related properties, copper wire bonding requires significant higher bond processing...
Wire bonding has been an established packaging technology for decades. When introducing copper as wire material for high power applications, adaptations to the bonding process and to machines became necessary. Here, challenges occur due to the stiffer wire material and changing oxide layers on the contact partners. To achieve sufficient process stability, a clean bond area is required, which can only...
Graphene films, produced by chemical vapor deposition (CVD) on copper foils, generally have a lot of line-defects, such as grain boundaries and nanogaps between adjacent graphene domains. We demonstrated to identify such 1-D defects with size less than 20 nanometers using friction force microscopy (FFM). These line defects can be clearly observed in friction force images, while no height variation...
A linear electrical generator is a kind of device which can be used to wave energy converter, for directly converting mechanical energy of a floating structure into electrical energy. A wave farm consists of multiple wave energy converters in a sea area. In the present paper, a numerical model is proposed considering the interference effect in the multiple floating structures, and the controlling...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.