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Scanning of main beam of radiation digitally at fixed millimeter wave frequency in a Substrate Integrated Waveguide (SIW) Leaky Wave Antenna (LWA) has not been investigated so far in literature. In this work a Half-Mode Substrate Integrated Waveguide (HMSIW) LWA is presented which steers its main beam digitally at fixed millimeter wave frequency of 26 GHz. Digital beam steering is made feasible by...
Beam-steering antennas are the ideal solution for a variety of system applications, it is most commonly achieved through using phased arrays, where phase shifters are used to control the relative of the main-beam. In this paper, a low-cost directive beam-steering phased array (DBS-PA) antenna using switched line phase shifters is demonstrated. The proposed DBS-PA antenna has four micro-strip patch...
In the gene regulatory network, the gene regulation loop often occurs with multiple positive feedback, multiple negative feedback and coupled positive and negative feedback forms. In the above gene regulation loops, the auto-activation loop acts are ubiquitous regulatory motifs in complex bio-molecular networks. In this paper, we study the effect of the substrate concentration for gene expression...
Lateral GaN-on-Si HEMT technology enables integrated high-voltage half-bridges with gate drivers. However, the capacitive coupling through a common conductive substrate influences switching characteristics. The measured hard-switching turn-on time with floating substrate increased to over 16 ns as compared to conventional source-connected substrate (1 ns), switching 300 V/4A with GaN ICs comprising...
This work presents the operation of a PCB-embedded diode-clamped multilevel-converter integrated circuit (IC) fabricated in a lateral, high-voltage AlGaN/GaN-on-Si heterojunction technology. It is demonstrated, that PCB-embedding is an appropriate assembly technique for lateral power ICs with high-integration levels. By placing DC-link capacitors onto the IC-package, parasitc inductances in the power...
High-density packaging of fast-switching power semiconductors typically requires low parasitic inductance, high heat extraction, and high thermo-mechanical reliability. High-density packaging of high-voltage power semiconductors, such as 10 kV SiC MOSFETs, also requires low electric field concentration in order to prevent premature dielectric breakdown. Consequently, in addition to the usual electromagnetic,...
In this paper, a novel full-SiC power module suitable for three-phase Current Source Inverter (CSI) applications is presented. Based on state-of-the-art CSI modules, the problems associated with layout asymmetry are analyzed through electromagnetic (Finite Element Analysis software) and electrical simulations (Spice environment). Prototypes of the power module layouts are fabricated and parasitic...
In the recent years, diamond Schottky diodes with high Figures of Merit have been demonstrated. Static and dynamic characteristics of diamond Schottky diodes are presented in this paper. The diamond substrate is associated with silicon MOSFETs in a power switching cell, showing promising switching characteristics. However, even if these diodes show a high current density, the effective total current...
Film bulk acoustic wave resonator (FBAR) filters are promising for the mobile communication devices. Frequency switchable filters are suitable for selecting the vacant frequency bands. Usual polarity unidirectional single layer resonator excites fundamental mode whereas polarity inverted double layer resonator excites second mode. In this study, we considered that polarity inverted structure is easily...
The frequency switchable filters are suitable for selecting the vacant frequency bands. Usual polarity unidirectional single-layered resonators excite 1st mode whereas polarity inverted two-layered resonators excite 2nd mode. We previous reported the frequency switchable two-layered PZT/PbTiO3 epitaxial film resonators[1]. However, PbTiO3 films grown on PZT/PbTiO3 films are difficult to obtain since...
If integrated circuit substrates are characterized from a propagative perspective, one can see that parameters such as the source current density distribution or the relative orientation between source and victim, also play a role in substrate coupling. In this paper, we analyze how different current distribution patterns excite interference propagation modes, in terms of matching and orientation...
This work proposes a Yagi-Uda array with fan-like driver for millimeter-wave application. The proposed antenna array is built on a low-cost and low-loss multilayer organic substrate for flip chip ball grid array (FCBGA) package. The package size is 16 × 8 × 0.44 mm3. The proposed four-element antenna array results in a peak gain of 12 – 14.5 dBi at operating frequency band. The proposed antenna achieves...
In this paper, reconfigurable slot antenna for LTE (2.6GHz), AMT-fixed service (4.5GHz), and WLAN (5.4GHz) applications is presented. There are two L-shaped slots and a U-shaped slot inserted in the ground plane. The size of the antenna is reduced as a result of these slots. There are three varactor diodes inserted in these slots. This is done for the purpose of frequency, directivity, and polarization...
A new DBC-based hybrid packaging and integration method is proposed in this paper. A multilayer power module is formed by a direct-bond-copper (DBC) and a window cutting printed circuit board (PCB). The SiC chips and PCB are placed and soldering on the DBC. Al bonding wires are used for connecting the chips and the PCB. A full SiC half-bridge power module is designed and fabricated in compact size...
Assigning network resources to Virtual Links (VLs) efficiently and on-demand is a challenging problem for any network virtualization solution. Known as the Virtual Link Mapping (VLM) problem, its objective is to compute the appropriate network paths with the required network resources that meet the quality of service expectations of arriving VLs while spreading the load over all nodes to maximise...
This paper teaches the way to achieve an optimum substrate isolation in RF switch design thanks to Deep Trenches Isolation (DTI). The role of Deep Trench Isolation in substrate coupling around active blocks is analysed in link to its ability to break the conductive buried layers in the substrate. Then, an accurate modelling approach based on quasi-static approach developed for inhomogeneous substrate...
In this paper we introduce a method to significantly reduce the substrate leakage current in an RF NMOS switch device without degrading the device figure-of-merit (Ron×Coff), and with no increase in device complexity. This is based on modifying the structure layout, and introducing dedicated sinks. These sinks prevent the substrate's minority carriers from reaching the source/drain regions, thereby...
This paper presents a fully integrated class-A mode Differential Power Amplifier (DPA) on a thin silicon substrate intended for being embedded into flexible electronic foil systems. A high-speed and cost-effective 95 GHz-fmax, 0.25 μm SiGe:C technology (IHP process SGB25V) is used. RF performance of DPA has been evaluated with the pre- and post-thinning measurement results at die level. The behavior...
Network Virtualization allows multiple tenants share physical network resources flexibly. As a newly emerging architecture, Software-defined network (SDN) decouples the control plane and data plane, realizes the efficient control of network traffic. The emergence of SDN provides network virtualization a new solution for virtual network deployment. One of the most challenging issues, called Virtual...
GaN-based normally-off Gate Injection Transistors (GITs) with p-type gate over AlGaN/GaN heterojunction are fabricated on bulk GaN substrates. Thickness of insulating GaN buffer layer is increased up to 16 μm for the presented device from 5 μm for conventional GITs on Si. The thick buffer reduces the parasitic output capacitances, which enables fast turn-off switching. The thick buffer and the use...
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