The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Failure location and mechanism analysis about a microsystem fault is presented in this work. The fault phenomenon of abnormal low output power amplitude appears only at low temperature during thermal cycle test. A series of analysis including internal fault location and replacing parts for validation help to find the fault origin: a line winding inductor. The failure mechanism of the failed inductor...
The design of cloud computing technologies need to guarantee high levels of availability and for this reason there is a large interest in new fault tolerant techniques that are able to keep the resilience of the systems at the desired level. The modeling of these techniques require input information about the operational state of the systems that have a stochastic nature. The aim of this paper is...
the increasing demand for light emitting diodes (LEDs) has been driven by a number of application categories. The construction of LEDs is somewhat similar to microelectronics, but there are functional requirements, materials, and interfaces in LEDs that make their failure modes and mechanisms unique. In this paper, the main failure modes and mechanisms of LED device and its driving module are investigated...
In this paper, a failure analysis on ball grid array (BGA) solder joints is revealed with the aid of scanning acoustic microscope (SAM), optical microscope (OM), scanning electron microscope (SEM) and strain tester. By employing both the nondestructive analysis and destructive analysis, it was found that crack of several BGA solder joints caused the failure of the printed circuit board assembly (PCBA)...
Induction motors are the mostly used electric machines in industry, due to their manufacturing features, which makes them more economical and robust. Consequently, it is of special interest to identify the most common faults present in these machines and develop reliable and cost-effective diagnostic tools to properly maintain them. In this context, the infrared thermography coupled with signal processing...
The effect of intermetallic compound (IMC) thickness on tensile behavior of the Cu/Sn/Cu micro interconnects was investigated after thermal aging under synchrotron radiation experiments, and the tensile strength of the full IMC interconnects was also measured. The results showed that a thicker IMC layer induced a higher tensile strength of the Cu/Sn/Cu interconnects. The average tensile strength of...
In the transition to lead-free process, one of the most prominent problems is the lead-free solder joint interconnection reliability. Interconnection failure analysis is an important tool for improving the lead-free PCBA product design as well as assembly process quality. Combining a typical fault case, this study deeply analyzed the failure phenomena and the failure mechanism as to interconnection...
This paper collected and classified the failure modes and mechanisms of quartz crystals from actual engineering application. Through related failure analysis cases, combined with scanning electron microscopy and energy spectrum analysis, failure analysis results of quartz crystals of common failure mechanism were presented and studied. The quality and process controlling and reliability screening...
Failure analysis is the process of collecting and analyzing data to determine the cause of a failure, often with the goal of determining corrective actions or liability. Negative Temperature Coefficient (NTC) thermistors, with its advantage such as high accuracy, high sensitivity, high signal to noise ratio and low cost, has been widely used in almost every field like home appliances, manufacturing...
In this study, we found that inappropriate TU (top Cu metal line) geometry design induced product reliability failures issue. The TU geometry, having poor compatibility with wafer test probe issue, couldn't withstand the stress of wafer test probe resulting in fractures. Due to the inappropriate TU geometry design had major disadvantages in circuits characteristics. Reliability estimations exhibited...
As the applications of micro electronic mechanical system (MEMS) are booming, more and more research and development activities are involved in the MEMS industry. For every new MEMS product with new functions, the manufacturing process will be tailored to cope with the changes. This requires reliability work to ensure the robustness of the new process. Thus, failure analysis plays an important role...
In semiconductor manufacturing for automotive as for many other industries, reliability tests are designed and implemented in order to predict failure rate in real life and applications. Physics-of-failure is used on the rejects observed in field and during the reliability tests to check them to stress the components as in life applications. Besides this qualitative study between field and reliability...
Contamination and Electrical Overstress are typical failure modes that may appear in failed devices. However, the clean exposure and excellent preservation of such failure sites is often found challenging or even impossible due to the limitations of the decapsulation techniques and tools available. The accuracy of failure analysis can be jeopardized during decapsulation due to the introduction of...
Accelerated degradation test is an efficient approach to evaluate the reliability of degradation products. An effective accelerated test must guarantee that the failure mechanisms of product under all accelerated stresses are consistent with that under the normal stresses. Otherwise, the reliability of product under the normal stresses cannot be accurately extrapolated from accelerated degradations...
Large scale and high density packaging of ASICs are usually achieved by FCBGA forms. The structure and materials are more complicated in FCBGA, which would cause reliability concerns in situations where thermo-mechanical stressing is dominant. Accelerated temperature cycling reliability test was performed on 90-nm/8-level copper based FCBGA packaging devices, and open failures dominated by thermo-mechanical...
Failure analysis is an important part in reliability analysis, while the traditional FMEA method could not analyze system with complex physical structure and functional logic by tables. Based on the Altarica language, this paper presents a method of product fault modeling and analysis for complex system. Then give examples of cold/warm backup system and reconfiguration system to verify the accuracy...
There are several electrical and mechanical components in various systems such as transistors, ball bearings, solder bond pads, batteries etc. that have existed for a long time and have sufficient failure history and supporting studies on the root cause of these failures. For such cases, the failure mechanism may already be quite well known. With prior knowledge of the physics of failure, a good prognostic...
With the development of IC manufacturing industry, plastic encapsulated MOS components have been widely applied. Since higher performance requirement from users, the research on the reliability of plastic encapsulated MOS components is especially important. Through researching the common failure mechanism of plastic encapsulated MOS component, the physical and chemical processes of each failure mechanism...
This paper describes the effects of constant and varied maintenance strategies through an example of artificially generated failure data. During the constant maintenance strategy two main cases are distinguished. In the first example constant number of failures while in the second example specified percentage of failures are prevented with maintenance every year. Through the case study of the varied...
The power elements are the weak parts of integrated circuits (ICs), in fact, through these elements the power is usually dissipated as heat. This provides two effects: non-uniform generation of the heat across the die and temperature gradients. Understanding this phenomena is very important for choosing the right location of sensitive components, like thermal sensors, in order to improve reliability...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.