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Monoculture in a computer network is defined as executing the same protocols and software on all the networking devices. Multiple, correlated failures may be triggered in a monoculture network by attacks that exploit existing vulnerabilities in either protocols, software, or hardware. In this paper, optimal multiculture network design is used to improve the network reliability in the presence of correlated...
With the increasing use of medium voltage drive systems in power plant, it is interesting to develop a novel internal electrification scheme based on common DC bus concept. Despite obvious improvement on efficiency increasing, one of the most concerned issues is whether reliability performance would decrease to an unacceptable level led to by introduction of common DC bus layout. To mitigate the concern,...
In-network caching is an inherent feature of Named Data Networking (NDN), and the basic data unit of naming and caching in NDN is called “chunk”. However, a chunk needs to be further fragmented into fragments when its size is larger than the link layer's Maximum Transmission Unit (MTU). Furthermore, fragments also need to be reassembled into the original chunk at intermediate routers so that subsequent...
Today’s control systems such as smart environments have the ability to adapt to their environment in order to achieve a set of objectives (e.g., comfort, security and energy savings). This is done by changing their behaviour upon the occurrence of specific events. Building such a system requires to design and implement autonomic loops that collect events and measurements, make decisions and execute...
Railway transport is one of the main transport modes of the Russian Federation, which is strategically important for the country. Artificial constructions on the railways are complex and responsible elements of the track economy. The probability of their failure-free operation must be high enough. For the adoption of optimal solutions for managing the technical state of man-made structures, it is...
In today's economic conditions, engineers are faced with the problem of designing complex distributed computer systems under tight deadlines. Ensuring high reliability and robustness of such systems requires redundancy of their structure as well as the processes of data transmission and handling. The purpose of this study is to create simulation models and means to support computer-aided design of...
Maintaining reliability for electrical distribution systems that support processing facilities is a constant challenge due to aging equipment and other factors. Upgrades and replacements require significant engineering, extensive capital, scheduling, and shutdowns. Investment in electrical infrastructure is often marginalized and only addressed upon an unplanned failure or necessary expansion. Without...
Microgrid (p, g) is the present buzzword in the power industry with the new approach that it provides the grid operators to operate the grid. The unexpected weather events, increased electricity needs and potential threat to the cyber-security of the grid have raised several questions over the reliability of the grid with μ,gs turning out to be the pragmatic solution to improve reliability. In this...
In an era of continuously shrinking technology and escalating power density, Multiprocessor System on Chips (MPSoCs) suffer from a growing prominence of device defects and increase of dependability-related issues. This paper tackles the dependability challenge by suggesting an adaptive reliability enhancement strategy for multicore systems. We dynamically adapt the reliability enhancement to the actual...
The structural design for LED packaging is of great importance. S o far, the methods for LED packaging are mostly from the perspective of enhancing the emitted light's optical performance. In this paper, we proposed a statistical method for the structural design of LED packaging in terms of lumen reliability. Orthogonal experimental design was used in the determination of the experimental scheme....
The structure design of ceramic package for packaging system in package is introduced in this paper. The reliability experiments of multi-layer ceramic package were simulated and analyzed by using the finite element method. We mainly studied the influence of the side size and sealing ring size on the reliability of the ceramic package structure, analyzed the stress and strain distribution of the ceramic...
In this paper, a chip level stacked module, 100-µm pitch chip on chip (CoC) interconnection with Cu/Sn/Cu microbumps, was assembled by thermal compression bonding process. Daisy chain circuit in the package is electrically connected to high speed Data Acquisition (DAQ) thus transient resistance and drop number are recorded during drop test. The cross-sectional images of failed samples are inspected...
Conductive anodic filament (CAF) formation, a failure mode in printed circuit boards (PCBs), which has been reported in 1976, has caused catastrophic field failures on electronic product. With the trend of high circuit density demands in organic packages, the pitch of plated through holes (PTHs) in packages should be reduced, and the amount of CAF failures is expected to be significantly higher. The...
A railway turnout maintenance scheduling problem considering reliabilities is investigated. The problem integrates the selection of time windows, the optimizing of maintenance starting time as well as the assignment and routing of teams. It is mathematically formulated as a variant of the multiple traveling salesman problem with multiple time windows. A linearization process is presented to solve...
A Multi-State System (MSS) is a mathematical model in reliability engineering that allows representing investigated system/object using several performance levels from perfect working to complete failure. A new approach for the analysis of a MSS based on mathematical methods of multiple-valued logic is proposed in this paper. In particular, the method for the calculation of critical system states...
In view of the reliability of micro electro mechanical system (MEMS) devices, the common failure modes and mechanisms of MEMS are introduced through a lot of data research and failure information collection. The key failure modes of MEMS (adhesion, mechanical fracture, and wear) and their failure mechanisms are further analyzed and summarized. Meanwhile, the corresponding prevention and improvement...
Silicon Carbide (SiC) Metal-Oxide-Semiconductor Field-Effect Transistors (MOSFETs) have the potential to increase the power density in power electronics converters compared to the currently used silicon (Si). Their benefits are higher efficiency, higher switching speeds, and higher operating temperatures. Moreover, SiC MOSFETs, which are normally-off, offer the possibility to directly replace Si Isolated-Gate-Bipolar-Transistors...
In this paper, we examine the online authentication method based on Merkle (hash) tree focusing on its reliability. Coming from side channels in online authentication, the effectiveness runs into danger in the long run. With consideration of effectiveness, we present a Merkle tree based online authentication resilient against side channels by obfuscating authentication proofs. Security and efficiency...
This paper deals with reliability schemes, and in particular with hammock networks. Inspired by the regular structure of the cytoskeleton inside axons we present one way of extending the classical (2D) hammock networks to 3D. As an introductory example, we consider and analyze here the smallest 3D hammock network. This is compared against equivalent 2D hammocks as well as straightforward cylindrical...
The fabric architecture, which can realize massive packet forwarding even with small switches/routers, has been widely used as a network infrastructure in data centers in order to achieve high scalability and low cost. In carrier networks, large scale routers have been adapted as core routers due to the requirement of high density for accommodating a large number of users. Furthermore, the redundant...
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