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3D multi-layer chip stacking is a significant assembly challenge with dependencies on die size and thickness, interconnect pitch, bump diameter, number of dies involved, and die warpage. The assembly processes used to overcome the technical difficulties associated with the stacking of medium and large logic dies with fine pitch copper pillar bumps is discussed, including mass reflow and thermo-compression...
This paper reviews the development of chip rework processes at IBM, from leaded bumps on ceramics to lead-free on organic carriers, with emphasis on the latter. Traditionally, when fabricating high performance multichip ceramic modules, the ability to remove one or several chips after testing the fully populated module becomes important in ensuring that it has a full complement of functioning chips...
It has been well documented that older adults, especially women, are more inclined to express fear of crime, but their risk of victimization is significantly lower than for people from other age groups. Even if gender issues related to fear are known, fear of crime among men is undocumented. This article explores how worry about victimization among older men (N=156), from 3 francophone cities in Quebec,...
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