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3D multi-layer chip stacking is a significant assembly challenge with dependencies on die size and thickness, interconnect pitch, bump diameter, number of dies involved, and die warpage. The assembly processes used to overcome the technical difficulties associated with the stacking of medium and large logic dies with fine pitch copper pillar bumps is discussed, including mass reflow and thermo-compression...
A methodology for electronic non-destructive failure analysis of 3D-ICs is presented. The method is centred on the Electro Optical Terahertz Pulse Reflectometry technique. Through use of 3D Electromagnetic modelling, a Virtual Known Good Device can be established allowing the means to locate faults in a 3D package design. Measured voltage waveforms generated using the Electro Optical Terahertz Pulse...
A typical flip chip plastic ball grid array (FC-PBGA) module utilizes a laminate substrate, which has a solder mask layer at the surface and a number of build-up layers. During reliability testing of the assembled chip-laminate modules under elevated temperature, humidity and voltage bias conditions, electrochemical reactions can proceed in the solder mask layer producing various oxidized copper (Cu)...
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