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Assembly process reliability for Optical Multi-Chip Modules (MCM) is studied and improved. In the optoelectronic (OE) chip assembly for the Optical MCM, the OE chip with Au stud bump is joined with Sn-Ag-Cu (SAC) soldered in a through-waveguide via on an organic substrate to obtain high optical coupling efficiency. Since solid-liquid diffusion of Au to molten SAC is rapid, and formation of brittle...
3D multi-layer chip stacking is a significant assembly challenge with dependencies on die size and thickness, interconnect pitch, bump diameter, number of dies involved, and die warpage. The assembly processes used to overcome the technical difficulties associated with the stacking of medium and large logic dies with fine pitch copper pillar bumps is discussed, including mass reflow and thermo-compression...
This paper reviews the development of chip rework processes at IBM, from leaded bumps on ceramics to lead-free on organic carriers, with emphasis on the latter. Traditionally, when fabricating high performance multichip ceramic modules, the ability to remove one or several chips after testing the fully populated module becomes important in ensuring that it has a full complement of functioning chips...
As flip chip packaging evolves, there are increasing demands on the overall package design in order to maintain reliability while the devices themselves are increasing in performance. A key aspect for advanced flip chip applications that require a heat sink, is to ensure the integrity of the interface between the silicon chip and the heat sink (often a referred to as a lid or heat spreader). The challenging...
This paper provides a comparison of bonding process technologies for chip and wafer level 3D integration (3Di). We discuss bonding methods and comparison of the reflow furnace, thermo-compression, Cavity ALignment Method (CALM) for chip level bonding, and oxide bonding for 300 mm wafer level 3Di. For chip 3Di, challenges related to maintaining thin die and laminate co-planarity were overcome. Stacking...
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