The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Low temperature soldering can reduce the thermal damage which is caused by thermal expansion mismatch among various materials in an electronic package. Eutectic Sn58Bi solder is a promising low temperature lead-free solder due to its lower melting temperature. The effects of Ag and Cu additions on melting characteristics, wettability and microstructures of Sn58Bi lead-free solder were investigated...
In this paper, the Bi-11Ag solders with additions of 1wt.%, 3wt.%, and 5wt.% Sn are prepared to investigate the microstructure, melting characteristic, and tensile strength of the solder joint. The result shows that the melting temperature decreases to 154 °C as the Sn continuously added; the microstructure was refined when the addition of Sn was below 5wt.%, as it reach 5wt.% or more, the dendritic...
In this study, Cu-cored ball with the diameter of 350µm and 550µm were applied to connect the Cu wire with the diameter of 400µm and 600µm, and the gap was then filled with the SAC305 solder. As a comparison, the SAC305 solder joints were also prepared. In addition, a thermal aging experiment at 150°C was carried out, and then the tensile strength and solder/Cu interfaces before and after the experiment...
Different current density and external loading were applied on pure Sn-plated surfaces to evaluate the effects of service conditions on the growth of tin(Sn) whiskers. The samples were aged at room temperature with an induced current density range of 0.1∼0.5×104A/cm2. Whiskers were found after 720 hrs aged at the room temperature and the maximum length was 2.0µm. While tin whiskers were much longer...
This paper presents a novel calculation framework for TTC evaluation with transient stability (TS) constraints with respect to an usual or a critical contingency set. The basic solution strategy for TTC evaluation is introduced, and the whole system architecture and computing flow are given in this paper. In order to implement the security margin of large-scale interconnected power system efficiently...
A small-size discharge heated barium vapor laser with an axial temperature controller was designed and made. The operational characteristics of the laser with different hydrogen additives and two excitation circuits were experimentally investigated and compared. The results indicate that the addition of a small ratio (1.5%) of hydrogen to neon and the interactive circuit (IC) can greatly increase...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.