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High-density packaging of fast-switching power semiconductors typically requires low thermal resistance and parasitic inductance. High-density packaging of high-voltage semiconductors, such as 10 kV SiC MOSFETs, has the added challenge of maintaining low electric field concentration in order to prevent premature dielectric breakdown. This work proposes a wire-bond-less, sandwich structure with embedded...
High-density packaging of fast-switching power semiconductors typically requires low parasitic inductance, high heat extraction, and high thermo-mechanical reliability. High-density packaging of high-voltage power semiconductors, such as 10 kV SiC MOSFETs, also requires low electric field concentration in order to prevent premature dielectric breakdown. Consequently, in addition to the usual electromagnetic,...
The continuing trend toward heavier load and high penetration of Distribution Generation (DG) units in low voltage rural distribution feeders requires power electronic-based solution alternatives for voltage regulation purposes. The design of power electronics in terms of size and cost used for feeder voltage regulation is proportional to their KVA ratings. An iterative optimisation algorithm known...
It is not uncommon for industries to use natural language to represent high-level software requirement specifications. It is also not uncommon for these requirement specifications to be translated into design and used further for implementation and generation of test cases in the software engineering life-cycle. These requirements are often ambiguous, incorrect, and incomplete. Finding them late in...
Using virtual prototyping (VP) design tool to evaluate power converter electro-thermal performance can help designers to validate prototype in a quick way. However, different system time-scale requires efficient electro-thermal simulation techniques. Thus, an approach by using average power losses of one switching cycle is presented in the paper to decouple electrical and thermal simulation so as...
The fast switching speeds and low specific conduction losses of wide band-gap semiconductors allow the realisation of high-frequency, high power-density switching converters with dramatically reduced passive component requirements compared to Silicon technology. However, careful attention must be paid to switching cell design to mitigate the effects of circuit parasitics and fast voltage transitions...
In a distribution power network, the load model has no certain pattern or predicted behaviour due to large range of data and changes in energy consumption for end-user consumers. Thus, a powerful analysis based on probabilistic structure is required. For this paper Gaussian Mixture Model (GMM) has been used. GMM is a powerful probability model that allows different types of load distributions to be...
A co-planar tab-slot type of interconnect demonstrator for connecting power switching devices and DC bus capacitors has been designed and constructed, aimed at low inductance switching. The demonstrator is composed of a double-sided tab connector and a dual polarity slot. This type of interconnect eliminates the use of screw terminal connection between a power module and the DC bus as well as between...
In this paper we introduce the use of combination of screening and shielding to suppress electromagnetic interference (EMI) generated by a switching cell. We investigate the screening of common mode (CM) currents and the shielding of magnetic fields generated by a model switching cell using a combination of simulation tools and measurements. Simulation results align with measurements very well up...
Manufacturing is a critical component of the U.S. economy, responsible for 12.5% of GDP, direct employment for over 12 million people, and close to 75% of U.S. exports of goods. The U.S. manufacturing sector, while it produces 17% of the world's manufacturing output, also represents a quarter of the country's energy consumption. On the R&D side, it is responsible for 70% of all private sector...
Monitoring extrinsic reliability performance in a given technology is often performed in a passive manner. Semiconductor devices (die) are sampled out of production environment, subjected to a series of electrical and mechanical stresses, and finally tested extensively to determine if stressing produced additional fails. This strategy is prone to missing issues which are localized to a lots or wafers...
SiC and GaN power transistors switching energy are compared in this paper. In order to compare switching energy Esw of the same power rating device, a theoretical analysis is given to compare SiC device conduction loss and switching losses change when device maximal blocking voltage reduces by half. After that, Esw of a 650V GaN-HEMT is measured in hard switching condition and is compared with that...
Virtual prototyping (VP) is very important for power electronics systems design. A virtual prototyping design tool based on different modelling technology and model order reduction is proposed in the paper. In order to combine circuit electromagnetic model with power semiconductor device models, a SiC-JFET behavioural model is presented and implemented in the design tool. A half bridge circuit using...
SiC and GaN power transistors conduction loss and switching losses are compared in this paper. In order to compare performance of the same power rating device, a theoretical analysis is given to compare SiC device conduction loss and switching losses change when device maximal blocking voltage reduces by half. Then static and dynamic characteristics of commercial SiC and GaN power transistors are...
Silicon carbide (SiC) devices have been adopted to push the boundaries further in terms of power density, conversion efficiency, switching speed or thermal capability. To have the benefit of such semiconductors, new packaging should be developed to meet all the advantages. In this paper, we present a reliable integrated concept of a new packaging solution for multi-chip SiC devices aiming to have...
This paper presents a novel resonant based, high power density power electronics converter solution for mid-feeder voltage regulation of a low voltage (LV) distribution network. Owing to the use of high switching frequency operation and a full soft-switching control strategy, the proposed converter is capable of superimposing LV compensation into the feeder voltage, to achieve a significant system...
The U.S. offers multiple mechanisms for funding both small and large businesses to promote innovations in science and industry. However, dating back to the 80s many U.S. companies have chosen to take products created domestically and manufacture them overseas. This has been a particularly disturbing trend in the semiconductor business leading to the loss of jobs and technical expertise as students,...
This paper presents a novel packaging structure which employs stacked substrate and flexible printed circuit board (PCB) to obtain very low parasitic inductance and hence feature high switching speed SiC power devices. A half-bridge module aimed at blocking voltage up to 2.5kV has been designed to accommodate 8 SiC JFETs and 4 SiC diodes. Electromagnetic simulation results reveal extremely low inductance...
Multi-sensor data fusion using Inertial Measurement Units (IMUs) is a promising technique for improving the performance of positioning systems. However, the performance of conventional sensor fusion algorithms based on the Kalman Filter (KF) is compromised in indoor environments due to non-line-of-sight (NLOS) propagation. In this paper, we propose a semi-real time tracking algorithm which uses a...
With the advent of cloud computing and the virtualisation of computer systems, challenges exist in managing resources and Virtual Machines (VMs) effectively. Cloud computing platform services offer scalable and resilient platforms, but are still not without complexity to the end user community; this paper proposes an alternative solution for the deployment of an intelligent private or public cloud...
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