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To fulfill the promises of wide band-gap (WBG) power transistors, circuit parasitics arising from the interconnection of these devices must be reduced through careful layout. While prior work has demonstrated guidelines for lateral, single-sided PCB layouts for half-bridges, this work presents the potential improvement in vertical, dual-sided designs by leveraging an electrically thin approach. Though...
One of the biggest challenges faced in the characterization of wide-band gap (WBG) semiconductors is the accurate measurement of the current through the device. Most measuring techniques available do not have the necessary bandwidth to capture the high-frequency current content in such systems. Many of the solutions that do have the necessary bandwidth introduce a “choke-point” into the system by...
An improved SiC MOSFET-gate driver integrated half-bridge module with folded layout using direct bonded copper (DBC) substrate is designed, fabricated, and tested. The bottom layer of the DBC is used as part of the power loop to achieve major reduction in the loop stray inductance. Due to the low parasitic inductance and capacitance, the gate resistor is chosen as zero to reduce the switching loss...
Micro particles in marine machinery systems contain vital information of the device working status. Statistics show that 75% of hydraulic system mechanical failures are caused by oil contamination. During the normal working condition of hydraulic equipment, the particles in hydraulic oil have a constant concentration and small size. When abnormal wear occurs, the concentration and the size of particles...
The radio frequency interference (RFI) problems are critical issue for communication devices. Among the components of the communication devices, the Analog-to-digital converter (ADC) is one of the important device which is related to the RFI problems, because of two reasons: one is that it is difficult to decouple the coupled noise after converting to the digital signals by ADC, and the other is that...
A new DBC-based hybrid packaging and integration method is proposed in this paper. A multilayer power module is formed by a direct-bond-copper (DBC) and a window cutting printed circuit board (PCB). The SiC chips and PCB are placed and soldering on the DBC. Al bonding wires are used for connecting the chips and the PCB. A full SiC half-bridge power module is designed and fabricated in compact size...
The fast switching operation of wide-bandgap power semiconductor devices deteriorates the Electromagnetic interference (EMI) noise characteristics of a power converter. The parasitic inductance in a power module is one cause of noise generator. This paper calculates parasitic inductance in a wiring pattern of module with Partial Element Equivalent Circuit (PEEC) method, and evaluates the current distribution...
High motor saliency is required to increase the power density, and to reduce the use of permanent magnets (PM). It is a common practice to reduce the d-axis inductance (Ld) as much as possible to obtain a high saliency ratio. But, we should look at the loss in the motor operation stage. Specifically in the field weakening region, a big negative d-axis current needs to be supplied to satisfy the voltage...
Given the recent interest in power delivery design for the Internet of Things (IoT), current work aims to design a packaged power delivery solution for IoT. The power inductor takes up a large amount of the area in such an implementation. Planar power inductors are preferred for fabrication simplicity and cost. However, air core inductors do not have sufficient area efficiency for IoT solutions, necessitating...
Discrete sub-system due to passive elements in motor drive require functional and structural integration to make efficient and power dense overall system. Such power dense system is the prerequisite in aerospace and marine applications. This paper presents the design optimization of integrated rotor-less inductors for high speed AC drive applications. Different slot-pole combinations are considered...
To improve the power density of a switching power supply, we attempt to reduce the transformer loss using a magnetoplated wire (MPW). Contrary to using a copper wire, the use of an MPW allows for a reduction of the winding loss component due to the proximity effect. In particular, we investigate the 1-MHz LLC resonant converter using an MPW. A 4.5% decrease in the power loss is achieved, giving 29...
This work addresses the design and the fabrication of small scale square planar coils with high density of turns and self inductances up to 170 μH. First, the modified Wheelers formula is used to determine the optimal number of turns in order to achieve the highest inductance. Then, an effective process flow based on polyimide (PI) and copper processing is presented, and the key aspects of the processing...
This paper sets forth the decoupling procedures for a triple-star interior permanent magnet machines where the inductances are mutually coupled between the three machine sets when the original model equations are transformed to the rotor reference frame. Dynamic and steady-state analyses based on this coupled model is complicated. It is very hard to ensure total independence of the controllers for...
Laminated busbars acquire significant importance even if they are a passive component in converters. Their flat and overlapped conducting layers allow good heat dissipation and reduced stray inductance. Topology optimization enables balancing the amount of copper used with the maximum temperature and stray inductance of the busbar.
Embedding of power semiconductor dies in PCB is a very attractive technology, especially to achieve interconnects with a very low parasitic inductance and resistance. In this paper, we focus on the contact resistance and current distribution in a large (6×6mm2) diode embedded in PCB, as a function of the layout of its topside contact. We demonstrate that by choosing a suitable contact layout, it is...
A systematic design of a zero-ripple Ćuk converter for PV/Battery-to-grid dc-dc conversion is presented. This paper derives the copper loss geometrical constant (Kg) for this kind of integrated magnetic core using a simplified yet intuitive flux-reluctance model. Unlike earlier designs, the design procedure is completely analytical and valid for a range of duty-ratio operation. Verification is done...
This paper presents the design, manufacture and characterization of connector-less 1200 V SiC MOSFET half-bridge power modules based on AlN DCB substrate. The modules contain four MOSFETs and no external antiparallel diodes. They are rated for a current of 40 A and include a shunt. Static and dynamic measurement results are presented. Multiphysics simulations are used to validate the measured data...
In this work we describe a simple and effective set of techniques to decrease the parasitic effects that undermine the performance of EMI filters at high frequencies. These techniques involve the use of bands of copper tape conveniently placed around the components of the filter. These techniques are practically cost-free and can be easily and quickly implemented on-site during pre-compliance tests...
In this research a modeling, design and analysis of the most suitable dimensions and the number of turns of the induction coil required for a certain brazing process was done by using FEM. Ansoft Maxwell computer package is used for this purpose. The simulation determines the electromagnetic field distribution inside the work coil by the required excitation current and frequency. Then the optimal...
This paper introduces an innovative concept of electrical-thermal co-design for high-Q 3D inductors using through-package-via (TPV)-based copper networks in ultra-thin power amplifier-integrated glass modules. The copper networks are designed to provide high quality factor inductors, and also simultaneously enable heat transfer in ultra-miniaturized glass packages. Such TPV-based 3D inductors achieved...
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