The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
With the strength of fine pitch, high electrical conductivity and excellent reliability, copper pillar interconnect becomes a promising alternative to traditional solder bump. However, bad surface smoothness is a severe problem and significantly affects the reliability of the bump connection. In this paper, numerical simulations on the shape evolution of copper pillar bump and the effect of bump dimension...
Tin-plated copper structure was widely applied in the electronic products. With the development of the electronics industry, the integration degree increased and the component size reduced obviously. The conventional tin plating technology met the micro-structure challenge; it may not be used in advanced electronic packaging process. The electroless tin plating technology could solve this problem...
Fabrication of anti-corrosion and self-cleaning superhydrophobic coatings for metallic surfaces which are regenerable and durable in the aggressive conditions has shown tremendous interest in materials science. In this work, the superhydrophobic coatings on metallic surfaces (aluminum, steel, copper) were prepared chemical etching process. Thermal, mechanical, ultra-violet stability of these coatings...
One key application for the manufacturing of MLB and HDI printed circuit boards are pretreatment systems aimed at providing the optimum adhesion of organic coatings such as Photoimagable Resists (such as Dry Films [DF] and Liquid Photo Imageable Resists [LPIR]) or Solder Mask's (SM). The most common way for this optimum adhesion to be achieved is to use an etching solution to roughen the copper surface...
Electroless plating of copper onto insulating substrates is a process broadly applied in the electronics industry for manufacture of printed circuit boards and decorative plating of plastic parts for automotive or consumer appliance. The key step involves surface activation of the dielectric surface for deposition in electroless copper bath. Palladium catalyst, either in its ionic form or metallic...
A thin copper layer is an integral part of a Through-Silicon via (TSV) structure. The copper layer experiences mechanical stressing through the temperature excursion, thus raising reliability concern of the component. Such reliability assessment calls for the determination of the mechanical properties of the thin layer. In this respect, this paper discusses the experimental study to establish the...
In this study, the effect of the crystallinity and the characteristics of grain boundaries on the grain boundary diffusion was investigated experimentally. The crystallinity and characteristics of the grain boundaries were evaluated by using an EBSD (Electron Back-scattered Diffraction) method. The atomic diffusion of the grain boundary was also observed as the change of the surface morphology of...
Localized electrochemical deposition (LECD) is a metallic microfeature manufacture technology that uses tiny simple electrode to plate in the cathode. Compared with other conventional lithography employed in the semiconductor industry, LECD has the advantage of simple operation and low cost, and it is particularly suitable for manufacturing some precise metal components that have high aspect ratio...
Dendrite-like Cu supported Pd catalysts were prepared for electroless deposition of Cu circuits. The as-preapred catalysts demonstrated excellent catalytic activity.
Diamond-Cu matrix composite with high thermal conductivity and low coefficient of thermal expansion has been the high-performance thermal management materials. High-performance copper-coated diamond composite powders were successfully prepared using electroless plating at an appropriate bath temperature, pH value, copper ions concentration. The XRD results showed the coated Cu was highly pure with...
In the liquid phase synthesis of metallic nanoparticles by electroless deposition, the morphology of product is strongly dependent on numerous synthesis conditions; for example, the type or quantity of solvent, precursor, reductant and dispersant species. In this work, the influence of the surface area of precursor on the size distribution of synthesized nanoparticles was investigated using a kinetic...
Spark Plasma Sintering (SPS) is normally carried out to obtain consolidated materials of low residual porosity. SPS can also be used for the preparation of partially densified (porous) materials. Partial densification is achieved during SPS by using relatively low sintering temperatures or pressureless conditions. For a pressureless assembly, short punches are used; in addition, sintering without...
Diffuse discharge can generate large-scale volume discharges at atmospheric pressure1, which could be used in surface modification of metal. In this paper, the feasibility of SiO2-like film deposition on copper surface by atmospheric pressure diffuse discharge is achieved. The diffuse discharge is driven by a microsecond-pulse power supply in a point-to-plate electrode configuration, and HMDSO (the...
Ultrasonic heavy wire bonding is a commonly used technology to conduct electrical devices in power electronics. In order to facilitate powerful solutions combined with an increased efficiency, involving a material change from aluminum to copper wire as conductor material takes place in recent years. Due to the material related properties, copper wire bonding requires significant higher bond processing...
Direct Cu-Cu bonding has been pursued by the semiconductor industry as the next interconnection node, for its superior power-handling capability, thermal stability and reliability as compared to traditional solders. However, manufacturability of Cu interconnections has so far been severely limited by the relatively high modulus of Cu, requiring costly planarization processes to address non-coplanarities...
In this paper, the interface adhesion and reliability between copper lead frame(C-19210) and resin prepreg material of different copper lead frame lamination pretreatment processes (CZ and brown oxide) was studied. Surface morphology, roughness, peel strength and moisture sensitivity level, MSL3, reliability tests were performed in order to investigate the performance between these pretreatment procedures...
Buildup PWB (Printed Wiring Boards) for semiconductor package is widely used which is laminated the buildup materials onto the core materials (high Tg FR4, FR5 or BT). Generally, epoxy based buildup materials is used without glass cloth for the package of ASIC's(Application Specific Integrated Circuits), CPU's, GPU's, and other IC's that require large numbers of I/O(input/output) circuits because...
In this study, we firstly synthesized ternary Cu2SnSe3 nano ink by novel organic solvent polyetheramine by solvent-thermal reflux method. Cu2SnSe3 thin films were prepared by solvent-thermal reflux method for Cu/Sn ratio in three different ratios of 2/1, 1.8/1, and 1.4/1. Structure, surface morphology, composition, and electrical and optical properties at different process conditions were measured...
Field emission of Graphene is limited by the surface morphology because the existing deposition methods lead to Graphene flakes that lay flat on the substrate. To overcome this problem, we grow vertically aligned Graphene flakes on Cu particles using chemical vapor deposition method. The Graphene flakes are oriented at some angles with respect to the substrate, leading to good field emission performance...
In this paper findings from the development of a new Non Etching Adhesion Promoter process (NEAP) targeting inner and outer layer bonding are discussed. The herein described approach propagates a nano-scale copper structure that forms a thin anchoring layer with increased surface area, but hardly contributes to the surface roughness. The superb adhesion results obtained to a wide range of dielectrics...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.