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Increasing I/O counts have led to ever decreasing cross sectional contact areas or, by default, an increase in solder performance expectations. A recognized measure of solder joint integrity is gained through High Speed Shear testing, (HSS). This article will statistically evaluate the solderability of the dominant final finishes with reference to some real life variables. The only skew is that only...
With the development of high density electronic packaging and surface mount assembly, fine pitch package or micro BGA are facing challenges such as miniaturization, high density and assembly problems due to the fine pitch and fine area array assembly limitation. Most fine pitch packages' pitch limited in around 0.3mm pitch. If pitches are smaller than this limitation, the manufacture of packages'...
Gait rehabilitation following stroke is often stated as the primary goal to improve quality of life. A wearable augmented feedback system which provides vibrotactile cues for post-stroke gait training is presented in this research. The system is capable of determining temporal gait parameters and thus identifies gait irregularities. A pair of custom-made insole, containing four Force Sensitive Resistors...
Copper/tin thermo-compression bonding technology has been a focus and hot spot of global research institutions for a long time. Inter-diffusion and intermetallic compound (including the metastable η-phase Cu6Sn5 and the stable ε-phase Cu3Sn) formation will occur at the bonding interface during the heating and pressing step of bonding experiments. Considering that tin is easily oxidized and copper/tin...
Electric cable is an important part of utility power and distribution system. In order to keep the system operation safely and reliable, acceptance testing for cable is necessary not only in-service but also manufacturing process. This paper proposes a novel testing technique which is able to classify the difference between normal and defective low voltage XLPE cable, namely polarization and depolarization...
There are several methods accepted by the industry for determining the electrochemical reliability for electronic assemblies. These methods are typically designed to either simulate humid environments in accelerated lifetime testing, or assess the species of ionic residues present on surfaces. Some can be used to test prototypes or test boards; others are more applicable for quality and consistency...
A novel SIW cavity based RF sensor is designed and developed for non-destructive testing (NDT) of dielectric and advanced composites at 1.5 GHz using the TE101 mode. The proposed sensor is fabricated on low cost FR-4 substrate, and excitation of fabricated sensor is done with 3.5mm SMA connectors. The material testing is performed using the cavity perturbation theory for real part of the permittivity,...
Severity levels of air pollutant rich in oxides, chlorides and sulfurs can cause severe corrosion on electronic equipment. Besides, high atmospheric concentrations of sulfur also can be found in wide variety of industries that use electronics. With the more and more severe environmental pollution, especially in regions with high pollution levels, the corrosion phenomenon will also directly or indirectly...
In this paper a wafer-level chip-scale packing (WLCSP) for si-based driver using bump technique will be presented. The WLCSP is completely fabricated using conductive redistribution layer (RDL) technology which include dielectric material polyimide (PI) and RDL metallization, then the copper bumps are electroplated on the under bumping metallization (UBM) layer. The diameter of the bump is 200um and...
This paper provides a summary of the testing of Underwriters Laboratories (UL) certified connectors to the electrical requirements of IEC 62561-1, Edition 1. The connectors were tested in configurations interconnecting Class I UL-certified stranded conductors. A discussion of deviations to the pass/fail criteria is provided along with recommendations on modifications to IEC 62561-1, including considerations...
The flexible partitioning scheme and increased number of prediction modes in the High Efficiency Video Coding (HEVC) standard are largely responsible for both its high compression efficiency and computational complexity. Each frame in HEVC is partitioned in Coding Tree Units (CTUs) of fixed size, which are then recursively partitioned in Coding Units (CUs). In typical implementations, CUs in a CTU...
This investigation based on dynamic behavior of solar cell, which is mounted on blades of windmill like structure along horizontal axis. This experimental work encourages, the feasibility of flexible solar panel under dynamic condition. Study of various performance parameters of solar panel are taken into consideration under static and dynamic condition of prototype. Parameters which decide the performance...
Accelerated reliability testing is widely used in the microelectronic packaging to evaluate the long-term reliability of electronic devices. Although a lower intermetallic growth rates in Cu-Al joint improved its performance in thermal aging comparing with Au wirebonds, it is a great challenge to pass through accelerated humidity tests for Cu wirebonds, because Cu-Al intermetallics are easily subjected...
An experimental evolution of the imaging detection system's 57–64 GHz ISM-band probe for security checkpoint applications is presented. The Dual-polarized antipodal Fermi tapered slot antenna with sin-corrugation (DP-AFTSA-SC) is a low profile microstrip probe that is lightweight, high gain and broadband, and achieves a good standard MMW image. The DP-AFTSA-SC antenna is employed as a sensor. Its...
The process of singulating IC packages such as Quad Flat Pack No-Lead (QFNs) by either a sawing or punching operation results in exposed copper on the sidewalls. This exposed copper surface can oxidize leading to poor or no solder wetting up the sidewall during the assembly operation. The consequence of this oxidized copper surface is either incomplete or no solder fillet formation during the PCB...
A simple testing procedure has been developed in order to investigate and screen the current interruption capability of vacuum interrupter contact materials. A synthetic circuit delivering adjustable AC currents, followed by a pulsed of 21 kV peak for 2 seconds has been used. The electrical tests has been developed to reproduce the conditions close to a fault current rated at 12 kV; only the recovery...
The industry saw the transition of flip chip technology from lead free solder system to Cu pillar bump a few years ago. The risk of fail location under electromigration (EM) shifts from the solder/UBM interface of the standard solder bump to the solder joint of the Cu pillar solder joint. This study investigated the performance of the Cu pillar solder interconnect under current stress testing and...
Two backward wave oscillator (BWO) designs are proposed for a 346 GHz source for fusion plasma diagnostics applicable for the MAST and NSTX-U devices. Both designs feature a double grating machined from bulk copper, using nano-machining technology.
Performance evaluation of a handheld network analyzer (field tester) for certifying balanced twisted-pair copper cabling is carried out in this paper. Some key parameters such as return loss, near-end cross-talk, and insertion loss for cabling have been investigated, in order to comply with the newly proposed IEC-61935 standard. Accuracy of the field tester is then compared with a four-port vector...
IEEE is considering developing a guide for evaluating turn and strand insulation in multi-turn form wound coils for medium and high voltage coils up to 15KV. It is hoped that this guide will prove useful in comparing different systems based on the degradation of the surge breakdown voltage of coils subjected to a series of rapid thermal cycles. This paper is an attempt to compare, process and performance...
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