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This paper reports on a large-size CPU package for UNIX servers which employs embedded thin film capacitor layers. The substrate of this package has two thin film capacitor layers in the surface of the core layer, which has a capacitance of 25 uF in total. In order to adopt this package substrate, we confirmed the effect of the thin film capacitor layers on the package assembly process. We actually...
In this paper, a Half-Mode Substrate Integrated Waveguide (HMSIW) with interdigital slots mounted on its surface is used to explore fixed-frequency beam-steerable characteristic of Composite Right/Left Handed (CRLH) antenna based on HMSIW structure. By combining varactors and the PIN diodes with the antenna structure, fixed-frequency beam-steering radiation pattern can be realized. Main goal of our...
Metal-insulator-semiconductor capacitors used as a RC snubber attenuate voltage overshoots which may occur during switching phases. These devices feature good temperature stability up to 200°C and can be integrated very close to power switches on the same transfer substrate. As the capacitors need to withstand high voltages in most applications, thick dielectric layers have to be used, causing significant...
This paper gives a general overview on the methods to reduce interconnect resistance and capacitance in a standard CMOS technology followed by a discussion on the physical constraints that dictate the minimum achievable loading. A newly demonstrated method that uses carbon-nanotube to assist the formation of vertically aligned porous structure is studied. The method was shown to be able to reduce...
Passive elements are indispensable in RF systems and are used for matching networks, LC tank circuits, filtering, … etc. Passive elements can be simply classified into distributed elements including transmission lines and waveguides. As the operating frequency moves into the microwave spectrum, the distributed circuits have a higher Q factor, and thus they are usually used for high-frequency applications...
This paper presents the design of stretchable elastomer-eutectic gallium indium tin capacitors fabricated with mechanical isolation structures towards strain stable, soft temperature and chemical sensors. Three shapes of isolation structures are investigated: rectangle, trapezoid, and labyrinth. The capacitors and isolation structures are cast in a 3D printed mold, and the response to strain in the...
Presented is a hybrid, networked, wireless humidity sensing circuit. The sensor element is a flexible, interdigitated-electrode capacitor that is inkjet-printed on a PET substrate. The variations in capacitance due to the humidity changes are measured through a small (approx. 4 cm × 3 cm), low-power, readout circuit which transmits the measurement wirelessly to a basestation. The transmission is realized...
Because of the extensive application prospect of flexible electronics, a capacitive humidity sensor fabricated on a flexible porous Polytetrafluoroethylene (PTFE) substrate is reported in this paper. Silver nanowires as a floating electrode were dispersed onto a PTFE substrate. Then, as humidity sensitive material, polyimide (PI) was spin-coated onto the silver nanowires. Finally, a pair of interdigitated...
An efficient semi-numeric boundary element method for the calculation of the response of interdigitated touch sensors is introduced and used to demonstrate interesting properties of embedded printed capacitive touch sensors on steel substrates. The strength of the method is that layer compositions with finite conductivity and arbitrary sequence of layer permittivities can be calculated efficiently...
Substrate termination of lateral 600 V-class GaN-on-Si HEMTs and half-bridges other than source-connection is investigated: Using conductive Si-substrates as current-return path and the GaN-buffer for high-side transistor-to-heatsink isolation eliminates parasitic inductances and thermal interfaces. Floating-substrate reduced 440 V switching times to 60% (reduced output capacitance) and fixed-to-ground...
Impedance design is the fundamentals of signal integrity at the very beginning, but controlled impedance is always costly or time-consuming for the high-speed channels. In this paper, many simulations of channel parasitics were taken and calculated that met with the specified impedances and correlated to the measurements very well. Selection of the different substrate stack-up without any layout modification...
High-frequency thin film transistors (TFTs) enable many important thin film circuits used in flexible large-area systems such as large bandwidth instrumentation amplifiers (related to fT) and high-frequency oscillators (related to fmax) [1,2]. In [3] fmax=10GHz and fT=2.9GHz were reported but using Si substrates and pulsed laser deposition for ZnO growth, which are incompatible with low-cost large-area...
Recently, β-Ga2O3 has shown its great promise for next generation high power device applications due to its ultra-wide bandgap of 4.6–4.9 eV [1]-[5]. Despite the very early development stage, β-Ga2O3 metal-oxide-semiconductor field-effect transistors (MOSFETs) have demonstrated a high blocking voltage of 0.75 kV and a breakdown field of 3.8 MV/cm [2][4]. However, a crucial disadvantage of this material...
In this paper we introduce a method to significantly reduce the substrate leakage current in an RF NMOS switch device without degrading the device figure-of-merit (Ron×Coff), and with no increase in device complexity. This is based on modifying the structure layout, and introducing dedicated sinks. These sinks prevent the substrate's minority carriers from reaching the source/drain regions, thereby...
The level of pH in body fluids can indicate the onset of infection or a chronic condition. A mechanically flexible pH sensitive graphene-cellulose interdigitated capacitive (IDC) biosensor for monitoring acidity in various types of body fluids is introduced in this paper. The planar IDC is printed on a nonrigid polymer substrate material and coated with a very thin passivation layer to prevent an...
This paper proposes a method of improving power delivery in a CPU package substrate with multilayer thin film capacitors (TFCs). Because TFC embedded technology can reduce the inductance of power delivery path, it can stabilize the power supply to the CPU. Higher permittivity, thinner layer thickness and wider conductor plane area results in larger capacitance. To further stabilize the power supply,...
Wearable sensors, capable of detecting various motions of the human body, present unique opportunities for the development of advanced electronic interfaces. Such sensors have widespread applications in robotics, medicine, and electronic gaming. Capacitive sensors have numerous advantages. They are physically robust, can be constructed from a variety of materials in different shapes and sizes, and...
This paper reports on a large-size CPU package for UNIX servers which employs embedded thin film capacitor layers. The substrate of this package has two thin film capacitor layers in the surface of the core layer, which has a capacitance of 25 uF in total. In order to adopt this package substrate, we confirmed the effect of the thin film capacitor layers on the package assembly process. We actually...
This paper presents the methods of eliminating the plasma-induced Si substrate damage in periphery regions, resulting from high aspect ratio etching process for 3D NAND fabrication. The impact of Si substrate damage is verified by the low and high bias power experiments. The result indicates more Si damage is present with high energy bombardment; therefore, high bias power is recommended to be inhibited...
This paper presents the quasi-static TEM mode analysis of shielded broadside-coupled suspended substrate stripline (SBSSSL) using a Modified Least Square Boundary Residual Method (LSBRM) and Finite Integration Technique supported on the commercial software CST EM STUDIO. A comparison of the obtained results is made with the available published data and CST EM STUDIO where very interesting convergence...
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