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Sn-Ag-Cu (SAC) solder is one of the most promising candidates to replace Sn-Pb (SnPb) solder alloys. Reducing the amount of Ag phase is an important approach to obtain new SAC solders with lower cost. In this article, different proportions of Bi element were added into Sn-1.0Ag-0.5Cu (SAC105) lead-free solders. The melting points of these alloys are examined and the corresponding tensile properties...
The high temperature storage test (HTST) was conducted on the SnAgCu/Ni-W-P and Ni-Fe solder joints. While the conventional Ni-P solder joints were used as comparison to study the diffusion barrier effect of Ni-W-P and Ni-Fe under bump metallization (UBM). Both cross section and top view for the microstructural evolution of solder joints during 150°C aging were observed by the scanning electron microscope...
Fe-Ni film with compositions of 45wt.% Ni, which is also denoted as Fe-45Ni, was used as under bump metallization (UBM) to evaluate the interfacial reliability of SnAgCu/Fe-Ni solder joint under electromigration (EM) test. For comparison, commercial Cu UBM was also adopted in the reliability test. The microstructural evolutions of these two UBM solder joints were observed by scanning electron microscope...
This paper proposed a temperature-dependent iron loss model and corresponding dynamic hysteresis model, where temperature coefficient ${k}$ is introduced to consider the thermal effect on eddy-current loss. The iron loss model is validated by massive experimental measurement of test samples, 1174 combinations of various temperatures, magnetic inductions, and frequencies for nonoriented silicon steel...
The failure of solder joints on Cu-Fe-P lead frame of power MOSFETs was found after long term services. The microstructures of failed and accelerated experimental solder joints have been investigated in detail in order to find out the failure mechanism. SEM, TEM, EDS and EPMA techniques were used in this study. Observed results showed that all failed MOSFETs had worked in the higher current while...
The failure of solder joints on Cu-Fe-P lead frame of power MOSFETs was found after long term services. The microstructures of failed and accelerated experimental solder joints have been investigated in detail in order to find out the failure mechanism. SEM, TEM, EDS and EPMA techniques were used in this study. Observed results showed that all failed MOSFETs had worked in the higher current while...
The electroplating process of Fe-Ni UBM thin film has been developed using modified Watts bath and customized wafer electroplating system. The main factors which can affect the Fe content in the UBM film have been thoroughly investigated. Two kinds of chemical analysis methods, titration and spectrophotography, were used to monitor the variation of bath component content under working condition. The...
Central to oxidative damage in Alzheimer disease is the production of metal-catalyzed hydroxyl radicals that damage every category of macromolecule. Studies on redox-competent copper and iron indicate that redox activity in Alzheimer disease resides exclusively within the cytosol of vulnerable neurons and that chelation with deferoxamine or DTPA removes this activity. We have also found that while...
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