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This paper reports the development of electrically conductive, polymer nanofibers fabricated by electrospinning and electroless copper plating. The electrospun nanofibers were made using a precursor consisting of styrene-isoprene-styrene (SIS) block copolymer and silver trifluoroacetate. For process development and materials characterization, the fibers were electrospun as a thin membrane on glass...
In this paper we present miniature Atmospheric Pressure Glow Micro Discharge plasma generator device with evaporating, liquid cathode. The device is fabricated in the Low Temperature Cofired Ceramics. This material offers low-cost fabrication and is temperature resistant. The device can be used to qualitative and quantitative investigation of some elements and molecules in liquid samples. In our investigation...
The RC delay, electro migration (EM) and TDDB performance become more challenges to meet device requirement as continuous geometry shrink on BEOL dual damascene interconnects. To overcome these challenges from interconnect patterning point of view, we proposed Cu subtractive RIE as a potential solution for next generation Cu/Low-k interconnects.
This paper describes for the first time an innovative approach to improve re-distribution layer (RDL) yields in advanced semi-additive processes (SAP). An atmospheric pressure ozone based treatment is proposed as an alternative to oxygen plasma treatment. The ozone treatment process is scalable, being appropriate for process wafers up to large panels, and is suited for small feature sizes down to...
The move towards low-k dielectrics and change of wire material from gold (Au) to copper (Cu) is being driven by the need for lower resistive-capacitive (RC) delay in circuits and cost. But this can increase the incidence of bond pad lifting. Finite element analysis (FEA) stress simulation prior to mass production can provide an insight to the probability of such failures and guide device manufacturers...
The plasma based copper coating process is an innovative process for the production of planar or three dimensional circuit carriers. Both conductor lines for logic circuits and conductors for high power transmissions can be realized. This paper describes the manufacturing process chain of direct metallization by plasma based copper coating and shows the potentials of this technology. Circuits can...
The electrical explosion of fine metal wire has been used as a common way to investigate the behavior of individual wire in the initial stage of wire-array Z-pinch before the global magnetic field dominates. This paper presents the experimental results of the electrical explosion of copper wires using negative polarity current with magnitude of 1∼2kA. The 20μm-diameter copper wires with different...
A quad flat no-lead (QFN) package delamination improvement and its related lead-frame (LF) copper oxidation effect were studied. Pudding mold adhesion testing method was utilized to determine the epoxy molding compound (EMC)/LF interfacial adhesion performance, chemical composition change including cupric oxide (CuO, Cu++) and cuprous oxide (Cu2O, Cu+) on LF surface oxidation structure was identified...
Many process steps in semiconductor manufacturing and packaging benefit from pristine surface preparation, such as descuming of photoresist, removal of native oxides, and surface activation. One particularly important surface process is the preparation of surfaces prior to copper plating. New technologies such as Copper Pillar and TSV plating for micron-scale interconnects are particularly challenging...
Positive and negative ion beams are extracted from a plasma sputter type ion source with the planar magnetron sputtering target. A planar copper magnetron target excites plasma by 13.56 MHz RF power. The extraction electrode faces the target with a pair of permanent magnets to reduce arcing for negative ion extraction. Positive and negative ions are extracted from the ion source, and the performance...
Yttrium-barium cuprates are of a great interest due their possible application in the manufacture of superconductors and devices on their basis. This paper shows the possibility to synthesize ultrafine powder of yttrium-barium cuprates using the system based on a coaxial magnetoplasma accelerator. Several methods, including X-ray diffractometry, scanning electron microscopy, transmission electron...
Spark Plasma Sintering (SPS) is normally carried out to obtain consolidated materials of low residual porosity. SPS can also be used for the preparation of partially densified (porous) materials. Partial densification is achieved during SPS by using relatively low sintering temperatures or pressureless conditions. For a pressureless assembly, short punches are used; in addition, sintering without...
The control of electromagnetic radiation with plasmas is studied in a microwave resonant cavity fabricated using additive manufacturing and copper electroplating. The resonant cavity is created between two conducting posts in a rectangular waveguide at 12.3 GHz and scattering parameters of electromagnetic radiation are measured using a vector network analyzer. Plasma is introduced in the resonator...
Acceleration of copper ions from ultra-thin targets by a short pulse laser (30fs) with intensity of 1020 W/cm2 were systematically studied using two-dimensional relativistic Particle-in-Cell code EPOCH2D1, which includes an ionization module. It was found that ionization dynamics play an important role in heavy ion acceleration, particularly in the generation of quasi-mono-energetic ion bunches. These...
This paper presents the design of a low mass RF power inverter at moderate to high power levels (e.g. tens of watts and above) for weight critical applications such as cubesat plasma thrusters. Our approach for mass reduction includes resonant switching operation at tens of MHz, and the 3D printing of light-weight scaffolds that form air core inductors after plating with a thin layer of copper. Specifically,...
One of the major area of interest of the electronics packaging industry is the formation of interconnects between the chips in a 3D package. Copper has been proven to be a suitable candidate for the conductive material in back-end-of-line due to its low electrical resistivity and high electro-migration resistance. Due to this favorable property of copper, it is also used to form microbumps and through...
Pulsed capacitively coupled plasmas (CCP) was applied to self-aligned-via (SAV) based all-in-one (AIO) etching process. Effects of bias and synchronous pulsed plasmas on the AIO etching process were analyzed to improve the reliability and reduce the RC delay in back-end-of-line (BEOL) copper interconnect system. For steps of hard-mask open and partial via etch, synchronous pulsed plasmas were applied...
Power semiconductor devices and systems enable the efficient conversion and management of electrical energy. Power electronic applications range from fewer watts up to several mega- and gigawatts. Driven by a continuous electrification of society, power electronics are not only found in the automotive and energy sector, but also in industrial and lighting applications, as well as consumer electronics...
The copper vapor resulting from electrode surfaces in arc devices, such as circuit breakers, may modify the characteristics of arc plasmas. The corresponding properties of plasmas contaminated by the metallic vapor are therefore needed to be determined before setting up physical models. In this paper, the equilibrium compositions, thermodynamic properties, transport coefficients, and combined diffusion...
Atmospheric pressure plasma is type of plasma that doesn't need low-pressure apparatus system. Compared to other procedure in generating atmospheric pressure plasma jet, the application of the dielectric barrier discharge (DBD) is comparatively simple. However, the details regarding the electric discharge properties and active species' forming reaction is still unclear. It is also important to understand...
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