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Laboratory of Electrification of Industrials Enterprises (LREEI) of boumerdes and CDTA have developed an in-house Helmholtz coil. It will be used as a source of external magnetic field for studying the Negative Bias Temperature Instability (NBTI) degradation mechanisms that can influence Metal Oxide Semiconductor (MOS) devices. This paper describes the different phases of design and construction of...
DC-DC converters with wide-bandgap semiconductors facilitate the operation at higher switching frequencies. Thus, inductors can be reduced in size which is beneficial in regard to power density and weight of the converter. As a drawback, high frequency inductors suffer from considerably large winding losses caused by skin and proximity effects. Litz wire is a possible solution but it results in a...
Failure of tap changer is a significant issue in reliability of a distribution transformer. For this reason, the tap changer faults requires detail investigation in order to understand the main causes. This paper presents an investigation to determine the applicability of using frequency response analysis measurement for diagnosing faults on tap changer. Two faults have been investigated were coking...
With the emerging trends in RF design domain, semiconductor process technology has also evolved to meet the stringent design requirements. Owing to better electromigration resistance, low resistance and dielectric constant, scalability, ability to handle higher current densities and efficient power consumption, copper interconnects have emerged as the widely accepted metallization option to aid silicon...
Improvements in characteristics of magnetic materials and switching devices have provided the feasibility of replacing the electrical buses with high frequency magnetic links in micro-grids. This effectively reduces the number of voltage conversion stages, and the size and cost of the renewable energy system. It also isolates the converter ports, which increases the system safety and facilitates bidirectional...
A new class of lightweight, multifunctional material has been developed for electromagnetic compatibility. This material, branded VeeloSTRIKE, was designed to provide lightning strike protection, broadband shielding, and electrical uniformity in carbon fiber reinforced polymer composites. Aerospace and defense prime contractors and integrators are evaluating this proprietary carbon nanotube blended...
In this study, we present an environmentally friendly and solution-based synthesis for copper nanowires (CuNWs) at a moderate process temperature. Transparent electrodes (TEs) are fabricated by spray-deposition and evaluated in terms of their electro-optical performance. Using ImageJ, the CuNW diameters are determined in an automated and reproducible way. Without any post-processing, the films show...
This paper reports the development of electrically conductive, polymer nanofibers fabricated by electrospinning and electroless copper plating. The electrospun nanofibers were made using a precursor consisting of styrene-isoprene-styrene (SIS) block copolymer and silver trifluoroacetate. For process development and materials characterization, the fibers were electrospun as a thin membrane on glass...
Thermal cycle testing is required sometimes as a type test for stator bar production for hydro generators. Based on the outcome of the test, a production is qualified by the owner or operator of the generating station. Because of this, it is important that the measurements performed during this test are as precise and non-intrusive as possible. During a previous investigation on thermal cycle testing,...
An area of printed electronics in which additional development is necessary is printable non-volatile memory, which will be essential for the development of fully printed RFID tags and sensors with integrated data storage.[1] An approach to making a printable memory is to utilize materials that exhibit resistive switching; devices based on this mechanism are often referred to as memristors.[2] However,...
This article describes a method of creating crossbar structures based on copper chloride and results of research such structures. It is shown that the obtained elements have a memristor properties. The used compound can provide better operation speed of elements in comparison with the materials studied earlier. The switching voltages of the investigated structures were 0.2 V and −0.25 V. Measured...
This paper aims to presents an overview of electrical contact resistance. The electrical contacts are important elements which can be found on all of the electrical installations from the power source to the consumer. The presence of an electrical contact on a current path always introduces an additional electrical resistance, named contact resistance. After an overview of the role of the contacts...
This work presents the thermal reliability test results of a metaconductor device on a glass substrate. Custom thermal cycling testing between room temperature and 100 °C has been performed for both Cu/Ni and Cu/NiFe metaconductor based transmission lines. The overall electrical performance has been well preserved between 300 kHz and 12 GHz. After a high temperature annealing treatment with 400 °C...
Flip-chip interconnects made entirely from copper are needed to overcome the intrinsic limits of solder-based interconnects and match the demand for increased current densities. To this end, dip-based all-copper interconnects are a promising approach to form electrical interconnects by sintering copper nanoparticles between the copper pillar and pad. However, the remnant porosity of the copper joint...
The paper will present a continuation of our investigation [1] in implementing a solderless assembly process for electronics. The addressed technology is known as the OCCAM process and was patented by Verdant Industries [2]. We present our proof of feasibility, at least for a prototyping phase on a single connection layer. Different from the original process that employs for the interconnection tracks...
To take full advantage of silicon carbide (SiC) devices' superior electrical and thermal performance, advanced power module packaging designs and suitable materials are required. In this paper, the development of a new high power density module using the Power Overlay (POL) packaging platform is presented. The wirebond-less packaging platform has shown significantly reduced electrical parasitics,...
We examine graphene for interconnects within a 7-nm FinFET technology. Multiple scenarios considered alter dimensions and/or materials to reflect realistic graphene interconnect fabrication. Replacement is restricted up to the 3rd BEOL metal layer (M3) as graphene is advantageous over copper in terms of resistivity only for line widths < 30 nm. Initial standard-cell level analysis is extended to...
Microstructure variation with post-patterning dielectric aspect ratio (AR) and post-plating annealing temperature has been investigated in Cu narrow wires. As compared to the conventional annealing at 100 ◦C for a feature AR of 2.6, both elevated temperature anneals and reduced AR structures modulated Cu microstructure, which then resulted in a reduced rate of electrical resistivity increase with...
The resistivity of damascene Cu is measured at cross-sectional area as low as 95 nm2. The impact of aspect ratio and line edge roughness on resistivity is investigated. Kelvin resistance test structures are demonstrated with 28 nm pitch wires patterned by directed self-assembly of lamellar block copolymers. The effective resistivity of TaN/Ta/Cu wires is compared with alternative metals.
Cobalt and copper interconnects with identical barrier and CMP processes were formed on ultra-low k (ULK) dielectric films at the 7nm node. Divot-free Co and Cu interconnects are demonstrated using the same CMP process. Co-filled dual damascene interconnects show high line yields with similar via resistance values compared to Cu. Co line resistance measures three times higher resistance than Cu. The...
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