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Packages of commercial Gallium-Nitride power semiconductors present increasingly small dimensions to enable low parasitic inductance, increasing the heat flux density of the package and the challenges associated with their thermal management. This paper compares between Printed Circuit Boards and Direct Copper Bonded as substrates for a Gallium Nitride based half-bridge from a thermal and reliability...
For evaluate the thermal behavior of a permanent magnet motor under different types of losses and various loss distributions, a simplified thermal circuit is proposed. The result shows that, the model presented in the companion paper is suitable to use in machine design with certain accuracy.
For deep ultraviolet light emitting diodes (DUV-LEDs) packaging, the choice of substrate directly affected its performance and reliability. In this paper, a structure was proposed to promote thermal management and lifespan of DUV-LEDs by introducing the ceramic substrate with copper filled thermal hole. The AlN ceramic substrates with different number of copper filled thermal holes were fabricated...
Power electronics has a great popularity in many industrial fields. Recently, in automotive industrial fields, the number of demand on electrical vehicles has been extremely rising. Those devices are required to have high thermal performance. However, conventional power device packages using wire are difficult to match that. So we have developed a new and expectable advanced package for power devices...
An entirely novel multilayer printed circuit board technology called EmPower allows embedding of chip components like power diodes, MOSFETs (Metal-oxide Semiconductor Field Effect Transistors) or IGBTs (Insulated Gate Bi-polar Transistors) at a significantly reduced module thickness into a glass fiber reinforced epoxy-resin layer built-up. One major concern is to handle the power loss within the given...
The work presents a new solution proposal to the cooling of concentrator photovoltaic cells. In our concept the microscale channels are integrated into the back surface metallization, the microscale channels are formed by electroplating copper around a photoresist channel pattern. This approach has the advantage that it has no restrictions regarding the solar cell material and technology. In this...
Within the scope of this work, we study the impact of embedded mini heat pipes on the overall thermal performance of PCBs. In a first step, the heat transfer of miniaturized heat pipes is quantified by measurements. The effective thermal conductivity and the maximum admissible heat flow are determined in dependence of the environment temperature and gravitational field orientations. In a second step,...
Pole number is the key parameter of permanent magnet synchronous machines (PMSMs) for some space limitation applications, especially electric vehicle. This paper focuses on investigating the influence of pole number on the electromagnetic and thermal characteristics of PMSMs for applications under space limitation. The analytical calculation methods of electromagnetic and thermal characteristics are...
Direct buried is the most common and widely used installation method for underground power cable system. However, the installation characteristics that have been used in recent times do not have an optimum level of cable ampacity which could not support the increasing demand of electrical energy utilization. Besides, the existing installation characteristics have deteriorated the operational lifetime...
A novel nanocopper-based packaging material was developed for robust, void-free thermal interfaces between LEDs and heat sinks/spreaders. It is applicable to other high power components and devices allowing sub-10 micron thermal interfaces to enable high heat transfer rates. Other applications are in TSV & wafer level packaging, embedded chip packaging, direct print of Si and Glass interposers,...
Copper clip package plays a critical role in meeting the increasing requirement for lower total device resistance RDS(on), higher power density and high frequency switching applications. The copper clips replaced traditional wirebond interconnect for high performance MOSFETs by providing lower resistance and inductance than multiple wirebonds and improves thermal performance. This paper will discuss...
Technique of rendering thermal sensation can connect people who are in remote locations, such as teletherapy and a multimodal system. Humans feel detailed temperature distribution and recognize the characteristic of a contacting object. Although, conventional method can only render the thermal sensation of a fingertip or a part of a hand. In the case of combining these techniques with robot for human...
The circuit (printed board) designers play an important role in the recent thermal design of electronic devices. Generally, small chip type components have low heat generation. However, recently, the heat generation density of small chip type components is increasing along with the downsizing of electronics. Small chip type components have no cooling devices, and heat dissipation from the components...
GaN power switches have better characteristics compared to the state-of-the-art Si power transistors. These devices offer high operating temperature and current densities, fast switching and low on-resistance. However, currently only a few producers offer technology of high voltage GaN transistors. Immaturity of this technology is the reason why experimental evaluation of GaN parameters must be performed...
The aim of this work is to investigate the impact of the heat sink thickness and material, as well as, of the convection coefficient of the water cooling system on the power-electronics module thermal stressing. The heat extraction capability of different thicknesses is tested. It is concluded that the thickest heat sink results in marginally lower temperature variation at the junction level compared...
A two-resistor model of the power chip in automotive electronic control units is presented based on Inverse-Method Algorithm. According to the results of simulation and experiment, the determination method of the two-resistor model parameters is provided, and the effect of the thermal resistances and printed circuit board copper coverage on the simulation precision of the power chip case temperature...
This study demonstrates a new cooling solution for the thermal management of mobile electronics. It uses a micro loop heat pipe (μLHP) with a thickness of 0.6 mm for the evaporator and 1.0 mm for the vapor line, and is designed to fit in the casing of a smartphone. We fabricated a prototype model of the μLHP by a chemical-etching and diffusionbonding process for thin copper plates. Heat from the heatgenerating...
Thermal test vehicles were fabricated with three different commercially available die attach materials: two Nano-Sintered Silver (NSS) materials and a Silver Filled Die Attach (SFDA). The thermal resistances of individual components were determined after their initial assembly and as they accumulated a total of 1500 thermal shocks from -55°C to +125°C. Initial testing showed that the package-level...
The electronics designing process exceeded the simple level of developing projects based on empirical approaches, when for every single change tremendous cost in time and money was spent in most of the cases. Moving the design process from the real to the virtual world changed the engineering perspective on what can be done in less time. As previous discussed [9], [12], signal integrity and power...
In this paper, we investigate the simulation of natural convection heat transfer of a power electronic component mounted on a heat sink. The heat dissipation is ensured by conduction from the base plate to a heat sink through the fins, and subsequently to the ambient air by convection. This work represents a comparative study of four heat sinks configurations having fins of various profiles adapted...
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