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To take full advantages of Wide Bandgap power semiconductor devices, breakthroughs on power module development are heavily explored nowadays. This paper introduces a 1.2kV SiC half bridge intelligent power module utilizing 80μm flexible epoxy-resin as substrates instead of traditional Direct-bonded Copper, for better thermal-stress management and lower cost. The investigation on the flexible epoxy-resin...
We present a TCAD process and analytical model based simulation analysis to investigate the effect of different stressors on nanowire FETs. We have utilized stress profiles extracted from TCAD process simulations and calculated mobility enhancement using the second-order piezoresistive model. Our analysis includes strained CESL and strained gate fill material for a gate-last process. Our process simulations...
The capabilities of multi-layer substrates to reduce mutual coupling between closely spaced (0.3–0.5 of the free-space wavelength) patch antenna elements in antenna arrays are investigated. The inhomogeneity is created in vertical direction by inserting relatively higher and lower permittivity layers on top of each other and to the appropriate positions inside the single-layer, homogeneous substrate...
In the case of stone relics with cultural heritage value that are exposed to the adverse effects of direct exposure to weathering, we present a metamaterial with a composite structure that can passively control the transmittance of infrared and visible light. This periodic multi-layer structure consist of metal and dielectric layers, these have the function of low transmittance at infrared wavelengths...
SAW filter technology includes different substrates, multilayered electrodes from Al, Cu, Pt, …, dielectric sublayers and over-layers, etc. Temperature compensated SAW filters have been developed that have performance competitive with FBARs. Traditional design tools, such those as based on COM models, demand experimental characterization of wave propagation parameters. FEM/BEM models cannot be easily...
This study report a simulation approach to fabricate virtually III-V MOSFET with high-k dielectrics using technology computer aided design, TCAD tools software from the company Silvaco International. In this, submicron InxGa1-xAs enhancement mode MOSFETs is simulated. This study presents current-voltage, I-V characteristics of III-V MOSFETs. Next, simulation work using Silvaco's TCAD Tools based on...
3D-printing technology promises high added value in many scientific contexts, including that of new materials for electromagnetics. The joint use with Radio Frequency Identification (RFID) technology is very appealing for designing new RFID-based smart devices while maintaining cost-effectiveness. In this work a T-Resonator structure for the dielectric characterization of substrates, including 3D-printed...
With the rapid increase in the number of integrated circuits I/O, the traditional wire bonding package has been unable to meet the high I/O number of interconnection needs, flip-chip process can undoubtedly solve the high I/O number of miniaturization package problems, especially flip-chip plastic package can fundamentally meet the increasing number of pins, improve speed and high frequency performance,...
Electromagnetic modeling of sensing of stochastic distributions of nanometer-sized particles usually requires a large number of calculations to correctly obtain the average response of a sensor. Here, we present an alternative method, which utilizes a gradient effective permittivity model based on the classical Maxwell-Garnett mixing formula. In our model the nanoparticle layer is homogenized into...
In this study, we perform a top gate field effect transistor by using the integration of novel materials such as graphene as active channel and fluorinated graphene as dielectrics on flexible Polyethylene terephthalate (PET) substrate. These device shows high carrier mobility (∼969 cm2/v.s) at a drain bias of +0.5V. It shows good mechanical flexibility and electrical stability after bending measurement...
Large scale and high density packaging of ASICs are usually achieved by FCBGA forms. The structure and materials are more complicated in FCBGA, which would cause reliability concerns in situations where thermo-mechanical stressing is dominant. Accelerated temperature cycling reliability test was performed on 90-nm/8-level copper based FCBGA packaging devices, and open failures dominated by thermo-mechanical...
All-carbon-nanotube thin-film transistors (ACNT-TFTs) are proposed and fabricated on a transparent glass substrate by a facile solution-processed method, with 95% enriched semiconducting single-walled carbon nanotubes (SWCNTs) serving as channel materials and mixed SWCNTs as source/drain/gate electrodes. The device demonstrates excellent electronic properties with an on/off current ratio over 105,...
A microparts manipulation application is presented. A PCB platform and plastic microparts with rectangular embedded conductive electrodes are designed. The electrostatic forces applied by the platform electrodes are calculated with F.E.M. analysis and the dynamic model of the microparts motion is used for the simulation of the motion. The proposed activation algorithms of the platform electrodes are...
The present article describes the investigations, performed in order to determine some dielectric characteristics of anodic aluminum oxide (AAO), obtained by electrochemical anodization process. The AAO layer is grown directly on aluminum substrates, considered as suitable carriers for multi-chip modules (MCM). Test samples for measurements of the dielectric permittivity and loss tangent were elaborated...
This paper presents a research focused on Aerosol Jet interconnecting of SMD components to flexible substrates. Flexible printed electronics is becoming important fast growing market segment. Contacting technologies of the electronic components are well known for traditional electronics such as soldering, welding, conductive adhesive bonding, however in the expansion of direct printing technologies...
This paper presents, for the first time, a novel silicon damascene like via-in-trench (ViT) interconnect for panel-scale package redistribution layer (RDL) configuration. The panel scale damascene RDL in this paper comprises of ultra-fine copper embedded trenches and microvias with diameter equal to the width of trenches using a 5 µm thick dry film photosensitive dielectric. A 140 µm thick glass substrate...
The tremendous growth in smartphones and tablets has been fueled by consumer demand for increased mobility, functionality, and ease of use. This, in turn, has been driving an increase in functional convergence and 3D integration of integrated circuit (IC) devices, resulting in the need for more advanced and sophisticated packaging techniques. In particular, the integration of the application processor...
High-throughput assembly of miniature wafer-fabricated packages onto panel substrates provides a manufacturing framework for high-performance multi-functional displays and other large-format systems. Control circuits, light emitters, sensors, and other micro-components formed in high-density arrays on wafers use a variety of processes and materials that do not easily translate to large-format panel...
As modern consumer electronics are continuously driven toward to thinner and compact size, shrinking of assembly package size is a must. One of the challenges for reducing package height is to reduce substrate height, given that substrate provided an essential ratio in heightens for the entire package. Single Layer MIS (Molded Interconnect System) is one of innovative assembly technology that can...
Precise measurements of the surface impedance Zs of conducting, semiconducting and superconducting materials is a common requirement for research, metrology and industry. The interest is often devoted to thin films because of (i) the possibility to grow nearly-perfect (single-crystalline) materials, essential for research and selected applications, or (ii) ease of reproducibility for, e.g., metrological...
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