The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
With the rapid growth in the mobile industry, Package-on-Package (PoP) technology has been widely adopted for the 3D integration of logic and memory devices within mobile handsets and other portable multimedia products. The PoP solution offers significant advantages, including increased density through stacking logic and memory devices in the same formfactor and a high degree of flexibility for variable...
This study aims to investigate the interfacial reactions of Sn-58Bi/Cu and Sn-58Bi/Cu-Zn solder joints during liquid-solid electromigration (L-S EM). L-S EM behavior of Sn-58Bi/Cu and Sn-58Bi/Cu-2.29Zn solder joints about external microstructure under 1.5 × 104 A/cm2 at room temperature was studied using scanning electron microscopy (SEM). For the two types of solder joints, the thickness of IMC layer...
In this study, the influence of adding Sn-0.7Cu, Sn-1.2Cu, Sn-3.0Ag-0.5Cu and Sn-4.0Ag-0.5Cu coating into Sn-58Bi/Cu interface was investigated during thermal aging by scanning electron microscopy with Energy Dispersive X-ray. And the coatings of the Sn-based solder on the Cu were made by using hot-dip method. The result showed the Sn-based coating on the Cu was effective at suppressing the IMCs'...
In these study, the effect of Bi content on shear strength of Sn-xBi (x=0, 2.5, 5, 15) solder balls were investigated. The Bi addition could improve the shear strength of solder balls, added 2.5wt.% Bi into pure Sn solder alloys had a greater increase in shear strength. The fracture mode always remained the same and the shear strength had no obvious changes with increasing the aging time. The Sn-2...
Recently, developing thick interfacial intermetallic compound layers with rough morphology has been detrimental to the long term solder joint reliability for lead free solders currently. A novel method has been developed to control the morphology and growth of intermetallic compound layers between pure Sn solder ball and Cu substrate by doping flux with amount of 2wt.% metallic Cu nanoparticles. And...
BGA micro-joint with double substrates used by SAC305 lead-free solder is fabricated by reflowing process based on substrate FR-4. The microstructures of the solder joints are studied through the method of rapid thermal cycling (RPC). The double-based plate Cu/SAC305/Cu solder joint was tested at extreme temperature 60–180 °C by rapid thermal cycling 48 hours and 72 hours respectively, it was found...
The voiding phenomenon at the interface has been proven to weaken the mechanical properties of solder joints. The aim of this study was to investigate the influence of grain size on voiding propensity. Two kinds of substrates were used: high purity oxygen free copper (HPOFC) substrate and electrolytic tough pitch copper (ETPC) substrate. Grain size and voiding propensity were characterized by introducing...
The interfacial reactions in Cu/Sn-9Zn/Ni micro solder joints during reflow under temperature gradient was investigated in this study. And corresponding isothermal reflow of the micro solder joints as a reference experiment was also conducted. The results indicate that the Cu atoms can migrate to the opposite Ni side even against the temperature gradient while the Ni atoms can only migrate to the...
In the transition to lead-free process, one of the most prominent problems is the lead-free solder joint interconnection reliability. Interconnection failure analysis is an important tool for improving the lead-free PCBA product design as well as assembly process quality. Combining a typical fault case, this study deeply analyzed the failure phenomena and the failure mechanism as to interconnection...
The anisotropic behaviors of micro solder interconnects have been recognized as a crucial reliability concern due to the continuous trend of miniaturization in high-performance electronic devices. The hexagonal structure η-Cu6Sn5 with highly anisotropic phase structure has considerable influence on its growth behavior during soldering and performance in service. In the present work, synchrotron radiation...
This study investigated the relations between base resins and flux compounds applied to NCF (Non Conductive film) for thermal compression bonding with micro Cu pillar bumps. As the use of NCF expands, outgas during flip-chip bonding process is being recognized as a serious problem because it lowers both of the productivity and the package quality. The flux compounds which are normally used to get...
System-in-Package (SiP) is becoming more and more important in integrating functionality while reducing final product form factors and cost. This is particularly true for mobile applications where continued effort to achieve ever thinning products is continuously pushing development of new materials, components and assembly technologies. This presentation focuses on a SiP flip chip (FC) pad design...
The polymer cored solder interconnect has been investigated in board level strain concerned ball grid array type IC package for many years. The novel solder ball with a polymer core is designed to compensate the board level reliability weakness of current metal alloy interconnect such as mechanical and thermal-mechanical fatigue endurance due to its unique spherical polymeric core able to absorb the...
Wafer Level Package (WLP) demand has been increasing in proportion to cost competitive device's demand year by year. In order to manufacture the WLP which has higher reliability efficiently, assembly processes with Bump Support Film (BSF) and Backside coating tape has been developed. The BSF consists of Back Grinding tape (BG tape) for getting a function as a wafer thinning and Bump Support Layer...
The trend towards multi-die flip chip packaging favors the incorporation of a qualified manufacturingcompatible rework process to remove and replace individual defective die. Inherent to the rework process is an electrical verification step that effectively identifies the defective device without compromising the integrity of an otherwise perfectly functional device. Unfortunately, the very feature...
Package warping during SMT reflow is a seriousconcern as warpage induced interconnect failures suchas Head-in-Pillow (HiP) and Non-Wet-Open (NWO) must be controlled. In this study, the high temperature reflow dynamicwarpage characteristics of BGA packages are examinedusing a simple, controlled gap between the solder balland printed paste interconnect to simulate separation andlifting of the joint...
3D IC packages with stacked silicon interconnects (SSI) have many performance advantages over conventional flip chip packages. Using SSI, various die using the same or different technology can be connected to each other with the use of an interposer. The interposer allows a large number of die-to-die connections, enabling higher interconnect bandwidth, lower power consumption, and lower I/O latency...
This study was aimed at quantifying critically relevant topics about the influence of intermetallic compounds (IMC) within power electronics reliability such as the influence of soldering profile on the growth rate of IMC in large area solder joints, estimation of IMC thickness during non-isothermal ageing and the impact of IMC thickness on reliability. To this end, test samples were soldered using...
Electromigration (EM) of Pb-free SnCu solder joints with NiPdAu surface finishes are studied. The failure mechanism and kinetics of electroless Ni-P dissolution under EM are discussed in detail. Under EM, depends on the Sn grain orientations, Ni atoms in Ni-P plating can be quickly consumed and the entire Ni-P plating can be transformed to P rich Ni3P. The volume shrinkage caused by this reaction...
Multiple device configurations, especially in 2.5D or 3D systems, are intimately tied to the successful implementation of very fine pitch, flip chip interconnection in order to optimize their potential for higher performance and smaller form factor. At the same time, such pitch reduction and increased I/O count create greater challenges to the interconnection process and its resulting reliability,...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.