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In this work, we have used nanoindentation methods to explore the creep behavior, and aging effects of SAC305 solder joints at several elevated testing temperatures from 25 to 125 oC. A special high temperature stage and test protocol was used within the nanoindentation system to carefully control the testing temperature, and make the measurements insensitive to thermal drift problems. Solder joints...
Isothermal aging of lead-free Sn-Ag-Cu (SAC) solder joints leads to growth of intermetallic (IMC) particles in the solder bulk as well as growth of intermetallic layers at the joint interfaces with copper bond pads. Fracturing near the interfacial IMC layers is often found to be the primary reason for failures caused by drop impacts. The IMCs in SAC joints are primarily AgsSn and Cu6Sn5 binary compounds...
Solder joints in electronic assemblies are often subjected to cyclic (positive/negative) mechanical strains and stresses. Such exposures can occur in variable temperature application environments or during accelerated life thermal cycling tests used for qualification. Cyclic loading leads to damage accumulation, crack initiation, crack propagation, and eventually to fatigue failure. In this investigation,...
In this paper, extensive testing was conducted to study the effects of Lanthanum (La) doping on the creep and fatigue behavior of SnAg lead free solder alloys. Variables considered in this paper include doping amount, aging temperature, and aging time. The experimental data show that rare earth element (RE) doping increases SnAg solders creep resistance by about 15%. Meanwhile, RE doping does not...
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