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This paper proposes small CRPA arrays with high-dielectric ceramic superstrates for dual-band operation. Each array element consists of inner and outer microstrip rings printed on a high-dielectric substrate, and a hybrid chip coupler is used for quadrature excitation to achieve circular polarization. The superstrates with high relative permittivity are designed to have a cylindrical shape and are...
Wide bandgap semiconductors enable high voltage (10 kV and more) switches. As a consequence, new packaging solutions are required to prepare the ground for such devices. The metallized ceramic substrate is a well-known and established technology for voltages up to 3.3kV, but it exhibits some weaknesses at higher voltages: due to its manufacturing process, the profile of the metallization is sharp...
The tungsten-rhenium thin film thermocouples (TFTCs) sensor is designed and optimized based on mechanical properties analysis, the process is optimal designed and the experiment shows the working hours of TFTCs sensor with optimal increasing from 10 minutes to 300 minutes at 900K, and the total work time reach to 600 minutes with a better output voltage when compared with our previously published...
The main objective of the Delphi4LED project (funded by the Ecsel European joint undertaking) is to develop a standardized method to create multidomain LED based design and simulation flow for the solid-state lighting industry. Tools and standards will be developed at various levels to enable design and manufacturing of more reliable and cost effective LED based lighting solutions which can be brought...
In this paper, we propose a feasible and prospective method to prepare copper-coated ceramic substrate by using nano thermo-compression bonding technology. Nanoporous copper (NPC) can be prepared by dealloying of Cu-Zn alloy system in L-tartaric acid solution. By controlling the concentration of L-tartaric acid solution and dealloying temperature, NPC presents good homogeneity and open bi-continuous...
White light-emitting diodes (LED) are widely applied in many fields for its special advantages compared with other light sources. Chip-scale-package (CSP) is one of the hotspots in the research of microelectronics, and also the main stream and development direction to the future package technology. Within a CSP, the solder layer between LED chip and substrate is usually achieved via reflow processes...
For deep ultraviolet light emitting diodes (DUV-LEDs) packaging, the choice of substrate directly affected its performance and reliability. In this paper, a structure was proposed to promote thermal management and lifespan of DUV-LEDs by introducing the ceramic substrate with copper filled thermal hole. The AlN ceramic substrates with different number of copper filled thermal holes were fabricated...
In this paper, a dual segment rectangular dielectric resonator antenna (RDRA) designed on an MgO-B2O3-SiO2-TiO2 (MBST) glass-ceramic LTCC substrate is described. The simulation results for the RDRA on MBST substrate is compared with those for RDRA on FR4 substrate. Another section of the simulation study includes the effect of composite substrates i.e. FR4-air (FR4C) and MBST-air (MBSTC) substrates...
Soft soldering is still the standard bonding method in order to provide a large void-free joining area in power electronics module applications. Ag sintering has been proven for small-area die attach applications to increase junction temperature and reliability. In this paper, we explore silver sintering technology further for large-area high-temperature substrate bonding in order to enable full benefits...
The polymer cored solder interconnect has been investigated in board level strain concerned ball grid array type IC package for many years. The novel solder ball with a polymer core is designed to compensate the board level reliability weakness of current metal alloy interconnect such as mechanical and thermal-mechanical fatigue endurance due to its unique spherical polymeric core able to absorb the...
In industry there is an increasing demand for reliable pressure sensors for applications in harsh environment. Pressure sensors working at high temperatures of 500 °C impose new challenges in packaging due to thermal cross sensitivity and temperature induced stresses on the package. Other major issues are to identify stable materials at high temperature and stress-tolerant sensor mounting techniques...
In this paper, Nano-indentation technology is used to test the mechanical property of the tungsten-rhenium thin film, including hardness, elastic modulus and residual stress. The effects of different heat treatment temperature and different substrates on the hardness and elastic modulus of tungsten-rhenium films were studied. We research three substrates which are silicon carbide ceramic, aluminum...
A tungsten-rhenium thin film thermocouples is designed and fabricated, and the characteristics of thin film thermocouples in different temperatures are investigated via numerical analysis and analog simulation. Protective film was presented to prevent from the oxidation and evaporation of tungsten-rhenium TFTCs at high temperature. The experiment shows TFTCs sensor with protective film have an acceptable...
This paper presents the experience in designing LTCC antennas operated in F-band (90–140 GHz). A few examined structures are presented and their electrical parameters dependencies on LTCC technology limitations are shown. The paper is focused on two main aspects: the first one is related to the quality of multi-layered structures and the second one to the properties of metallization, which has a big...
This study is mainly concerned with the synthesis of bio ceramic composite coating of HA (Hydroxyapatite) reinforced with Aluminium oxide and Iron oxide on SS 316L metallic substrates. These bio composite coatings are obtained by plasma spray technique. The microstructures, phase characterization, hardness and bioactivity of the coatings were investigated. XRD, SEM and EDS were used to examine the...
Miniaturization of radio frequency identification (RFID) reader front-end circuit based on low temperature co-fired ceramic (LTCC) is studied in this paper. LTCC makes the dimension of the circuit a reduction of about 30% which is compared with the traditional circuit substrate in ultra high frequency (UHF) band. It makes the size of RFID front-end circuit more compact than the traditional one.
Infrared (IR) sensor module deploy for hazardous gas leakage detection is crucial to provide and maintain offshore Oil & Gas platform asset integrity and improve operational risk management by avoiding accidental disaster and mitigating risk associated with danger involve in oil production. These sensor modules must remain robust under harsh ambient environment. Hence, designing novel high temperature...
Electronic products are becoming lighter, thinner and more compact as the diversity of product grows and functions become more powerful. As a result, the size of Surface Mount Devices (SMDs) used for the Surface Mount Technology (SMT) become smaller and the density of elements becomes significantly greater. The improvement of manufacturing process is increasingly important in order to maintain product...
Additive manufacturing (AM) has the potential to lead significant changes in the present state-of-the-art production processes. This provides tool-free and direct manufacturing of complex geometries simultaneously integrating various functions into components. Though AM techniques are widely used in various sectors, the applicability into electronics production has been not yet explored. In this paper,...
We present a highly accurate self-calibrating approach to investigate ceramic thermal barrier coatings on metallic substrates using terahertz (THz) technique in reflection geometry. The proposed approach enables the simultaneous determination of the complex refractive index and the coating thickness. Hence, a pre-calibration of the specimen under test is not required.
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