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When suspended elastic microstructures are unexpectedly pinned to their underlying substrates, it results in stiction failures. Over the last couple of decades a wide variety of processing, surface and physical schemes such as anti-stiction coatings, supercritical drying and sacrificial supports [1] have been employed to reduce stiction failure rates in MEMS, but most involve expensive machinery or...
This paper discusses direct growth of graphene on the interdigital electrodes for MEMS supercapacitor application. In addition, a high quality graphene was grown by using radio frequency plasma enhanced chemical vapor deposition (RF-PECVD) at temperature of 1000°C at various deposition time from 2–10 minutes at fixed power of 40 Watt. The graphene growth structure on the interdigital electrodes was...
We have developed the ultra-thin MEMS mirror device. The thickness of the mirror device is 5.31 μm including Si structures and actuators. The mirror device was fabricated using SOI wafer on which Pt/SRO/PZT/SRO/Pt/Ti/SiO2 were deposited. The device was bonded on a flexible polyimide substrate and wired using adhesion passed and conductive paste. The mirror device was operated on the bent substrate.
A back-side grinding CMOS-MEMS process is well established for thinning wafers down to tens of micrometres for use in stacking chips. As a result of the mechanical process, the wafer backside is compressively stressed. In this paper, authors investigate the influence of the backside induced stress in MEMS/CMOS wafers thinned down to 35∼275 μm by means of a micro-Raman technique. We found that the...
We report on a 32-MHz quartz TCXO fully integrated with commercial CMOS electronics and vacuum packaged at wafer level using a low-temperature MEMS-after quartz process. The novel quartz resonator design provides for stress isolation from the CMOS substrate thereby yielding classical AT-cut f/T profiles and low hysteresis which can be compensated to < ± 0.2 ppm over temperature using on-chip third-order...
Smaller footprint, thinner packages and simultaneously increased functionality are general requests for all electronic products and as well hold true for MEMS sensors. Current standard packaging technology for MEMS sensors is stacking the ASIC and MEMS silicon dies on a substrate. The sensitive dies are then either protected by over-molding or by attaching some sort of lid. Typical substrate materials...
In this paper, a novel multi-port MEMS switch is investigated. The switch is integrated on a chip of size 500μm × 500μm, while maintaining a high isolation between all ports up to 40 GHz. Electromagnetic (EM) simulation results are presented to verify the proposed concept. The switch is fabricated using the Multi-user MEMS processes MUMPs for integration on an Alumina substrate using flip-chip technology.
An automated electrodeposition process has been developed to produce low-stress freestanding metallic cantilevers for rf MEMS applications. The cantilevers are made of multiple layers of three different materials to achieve stress compensations. The fabrication is carried out using a PC-controlled deposition system developed in house. We found that the deposition rate increases with the increase of...
Aluminum with Sn intermediate layer shows very large deformation even below 400°C. Using this new layer structure as sealing metal, high yield hermetic package of MEMS was demonstrated at only 370°C without any treatment of surface oxide removal. During bonding, the bonding metal is significantly pressed (the reduction rate of thickness ∼90%), which guarantees hermeticity at high yield. Based on SEM,...
We present a fabrication method for thin-film polymer MEMS that achieves an order of magnitude improvement in feature size and resolution. Specifically, we modified the electron beam lithography (EBL) process for biocompatible poly(chloro-para-xylylene) (Parylene C), enabling flexible, encapsulated titanium structures with features as small as 100 nm. The mechanical, electrical and material properties...
In this work we demonstrate how a novel single free electron detector “Timed Photon Counter” (TiPC) may benefit from ultra-thin MgO transmission dynodes (tynodes). These membranes are fabricated through MEMS process technologies, with atomic layer deposition (ALD) as the most apt technique for growing films of good quality, with excellent control over thicknesses and extremely low surface roughness...
This paper reports a novel bi-directional electrothermal MEMS mirror with its mirror plate's position insensitive to ambient temperature and stable over time. In contrast, the electrothermal MEMS mirrors demonstrated previously are unidirectional and the position of the mirror plate changes significantly with ambient temperature and drifts over time. The new MEMS mirror design has been fabricated...
We developed an elastomer-based Fabry-Perot interferometer with 120–1080 nm gap between a freestanding thin film and a substrate using dry transfer technique. A newly developed elastomeric nanosheet using a polystyrene-polybutadiene-polystyrene triblock copolymer (SBS) provides low Young's modulus of 40 MPa, large elastic strain of 40%, and high adhesiveness. A freestanding SBS nanosheet can be formed...
Flexible accelerometers, attached on robotic or prosthetic components are needed for sensing the motion or orientation to augment functionality and ensure safety of users. Flexibility, bendability and low profile enable ubiquitous presence without hindrance to the user. This paper presents design, simulation, fabrication and experimental characterization of MEMS accelerometers, wafer-level packaged...
In this paper, we have proposed an extremely-small, low-cost and high reliability 3-dimensional micro-system which is composed of radio frequency (RF) components. The microwave monolithic integrated circuits of the T/R module are mounted onto a silicon substrate which is fabricated by MEMS technology. Some passive components, such as filters, attenuators and transmission lines, are embedded in the...
This paper investigates the use of transient infrared thermography in a transmission mode for subsurface defect detection within thin multilayer structures such as those found in MEMS devices. This was undertaken through the use of finite element analysis based simulations for several sizes of defects and for several combinations of substrate and thin film materials. The maximum temperature difference...
A finite element model for evaluating the performance of the MEMS air flow sensor with sapphire as substrate was established. The temperature distribution of the MEMS sensor chip with respect to different air flow was calculated by COMSOL Multiphysics. The trenches etched in the substrate were used to reduce the heat transfer from the heater to the temperature measuring thermistors within the substrate...
According to the analysis of substrate integrated waveguide structure, a design of double-layer and seven-order MEMS bandpass filter using network synthesis is proposed in this paper. The simulation and optimization are explained with Ansoft HFSS. Based on MEMS technology, a millimeter-wave filter is designed with a center frequency at 30GHz, the 1dB bandwidth range is 690MHz, the passband return...
This paper presents the design and optimization of high quality (Q) factor inductors using Micro Electro-Mechanical Systems (mEMs) technology for 10GHz to 20GHz frequency band. Two inductors have been designed with square and circular topologies. Inductors are designed on Silicon-on-Sapphire (SOS) because of its advantages including high resistivity and low parasitic capacitance. The effects of various...
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