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This paper reports on a large-size CPU package for UNIX servers which employs embedded thin film capacitor layers. The substrate of this package has two thin film capacitor layers in the surface of the core layer, which has a capacitance of 25 uF in total. In order to adopt this package substrate, we confirmed the effect of the thin film capacitor layers on the package assembly process. We actually...
Metal-insulator-semiconductor capacitors used as a RC snubber attenuate voltage overshoots which may occur during switching phases. These devices feature good temperature stability up to 200°C and can be integrated very close to power switches on the same transfer substrate. As the capacitors need to withstand high voltages in most applications, thick dielectric layers have to be used, causing significant...
Charge trapping properties of Al-ZrO2/Al2O3/ZrO2-SiO2-Si structures were investigated in attempt to elucidate the instability in their C-V hysteresis. The hysteresis in these structures is mainly due to subsequent trapping of electrons and holes injected from the Si substrate. However the competitive process of electron injection from the gate accompanied by the high leakage introduces instability...
This work presents the operation of a PCB-embedded diode-clamped multilevel-converter integrated circuit (IC) fabricated in a lateral, high-voltage AlGaN/GaN-on-Si heterojunction technology. It is demonstrated, that PCB-embedding is an appropriate assembly technique for lateral power ICs with high-integration levels. By placing DC-link capacitors onto the IC-package, parasitc inductances in the power...
In this paper, a novel antenna suitable for wearable LoRa devices is introduced. Its size is just 42.5 × 45 mm2, similar to the size of a watch, thanks to the advantage of a wire-patch antenna structure. The proposed antenna operates at 868MHz frequency band with the realized gain up to 0.4 dBi. This antenna is proved to be better than former designs by obtaining azimuthal polarization which reduces...
This paper presents the design of stretchable elastomer-eutectic gallium indium tin capacitors fabricated with mechanical isolation structures towards strain stable, soft temperature and chemical sensors. Three shapes of isolation structures are investigated: rectangle, trapezoid, and labyrinth. The capacitors and isolation structures are cast in a 3D printed mold, and the response to strain in the...
This paper addresses one of the most advanced technologies that meet the demand for the miniaturization of modules and devices with increased performance. In this paper, the glass-based inductor whose Q factor is up to 60 can be prepared by picking glass as the substrate and using the trough glass via technology to form the three-dimensional glass inductor to reduce MOS parasitic capacitor losses...
Silicon interposers are frequently used in memory and network processor systems to closely integrate multiple chips and improve the performance of high-speed systems. The proximity provided by silicon interposer greatly improves bandwidth, power, and latency by simplifying communication and clocking of the links. However, the design of silicon interposer systems poses new challenges in managing the...
In this paper, a LC (inductor capacitor) wireless gas sensor is demonstrated for the identification of volatile organic compounds (VOC's) in the air environment. A near-field LC resonant tank consisting of an interdigitated capacitor fabricated on a porous flexible substrate coupled with an inductor coil is used as a sensor and its resonance is interrogated using an external pick up coil. The porous...
This paper proposes a method of improving power delivery in a CPU package substrate with multilayer thin film capacitors (TFCs). Because TFC embedded technology can reduce the inductance of power delivery path, it can stabilize the power supply to the CPU. Higher permittivity, thinner layer thickness and wider conductor plane area results in larger capacitance. To further stabilize the power supply,...
In this paper, a mass production solution of integrated passive device utilized on radio frequency communication systems was proposed through a glass panel platform where the size could be up to 408 mm * 512 mm and provided 1-layer capacitor and 1-layer inductor for IPD design. The structure characterization of panel-based IPD was performed as well as the electrical stability and RF functional test...
This paper presents a low loss self-packaged quasi-lumped-element high pass filter (HPF) based on substrate integrated suspended line (SISL) technology. The HPF is composed of double metal layer spiral inductors and interdigital capacitors. And the dielectric loss for the filter elements is further reduced through hollowing the support substrate. The HPF also has advantages of self-packaging, low...
This paper reports on a large-size CPU package for UNIX servers which employs embedded thin film capacitor layers. The substrate of this package has two thin film capacitor layers in the surface of the core layer, which has a capacitance of 25 uF in total. In order to adopt this package substrate, we confirmed the effect of the thin film capacitor layers on the package assembly process. We actually...
To minimise the number of cells required for analysing numerically a planar circuit, an hybrid meshing technique that combines 1D and 2D cells is presented in this work. Thanks to this discretization procedure of the Partial Element Equivalent Circuit (PEEC) method, the connectivity between 1D and 2D model partitions is made using an unstructured mesh. In this way, it is possible to match regions...
This paper proposes a distributed reactance compensation technique, which is a useful approach for reduction of dielectric loss in a substrate of printed spiral coils. Distribution of lumped capacitors between coil windings reduces voltage fluctuations, and thus the strength of electric field, finally yielding lower dielectric loss. The usefulness of the proposed technique was verified by both simulation...
The displacement and stress-strain distribution of a device-embedded substrate under bending stress was simulated using the finite element method (FEM). In addition, the capacitance change of embedded devices was measured experimentally using an actual TEG substrate under bending stress. The results of the FEM analysis indicated that tensile stress at the surface of an embedded device may be a cause...
An experimental analysis is presented spotlighting the performance differences of horizontal and vertical mounting of multilayer ceramic capacitors (MLCC) on a PCB in electronic design and simulation. The MLCC performance depends on the orientation of the electrode plates with reference to the ground plane. The measurement of capacitor vertically mounted eliminates the odd-numbered parallel resonances...
We propose a new printing method based on gravure offset mechanism called Soft Blanket Gravure (SBG) printing. In contrast to conventional gravure offset printing, which cannot print lines of largely different line widths, SBG printing can print interconnects of widths of 50–1000 micrometers simultaneously using silver ink on a substrate We demonstrate the successful fabrication of SBG-printed capacitors...
Started with a physics-based fuzzy formulation, the Fuzzy EM does a rigorous derivation, built-in with one or two arbitrary constants, and leads to an accurate CAD formula of a practical circuit component. Bootstrapping means that the CAD formula resulted is in turn taken as fuzzy formulation leading to the CAD formula of a more complicated component. In succession, a bootstrapping series is formed...
A coplanar balanced composite right/left-handed (CRLH) leaky-wave antenna (LWA) structure designed on a 2 mil polyimide membrane is presented. This antenna exhibits broadside radiation at a C-band frequency corresponding to the transition between the left-handed and right-handed bands of the CRLH. Good agreement is observed between the predicted and measured radiation patterns over a 100 MHz bandwidth...
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