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This paper is presenting Finite Element Tearing and Interconnecting (FETI) simulation results of large scale Ka-band lens transmit-arrays obtained on massively parallel clusters. The computation times observed with the FETI method allow us to consider using it in the optimization phase of such transmit-arrays.
This paper presents the design and the optimization of interstitial microcoaxial applicator antenna for microwave ablation treatment (MWA) of breast cancer. MWA is proposed as a treatment for breast cancer in initial or intermediate stages and involves the application of an electromagnetic field that generates a temperature increase in the cancerous tissue. A model and the validation of microwave...
The benefits of emerging wide-band gap semiconductors can only be utilized if the semiconductor is properly packaged. Capacitive coupling in the package causes electromagnetic interference during high dv/dt switching. This paper investigates the current flowing in the parasitic capacitance between the output node and the grounded heat sink for a custom silicon carbide power module. A circuit model...
Piezoceramic discs bonded to structures have often been used as broadband transducers. We observed that a 2 mm thick, 10 mm dia. disc bonded to a 27 mm thick steel plate exhibits pronounced ringing near 250 kHz when driven by a broadband chirp. Lamb wave and defect localization studies using an array of such transducers are degraded by the ringing, which is not observed on thin plates. Our objectives...
This paper designs a vertical-interconnect transmission structure which could be applied in PoP(Package on Package) package structure. In this model, Through Mold Via(TMV) transmission structure is utilized to realize inter-side and stacked-model interconnection. A quasi-coaxial via cluster connected to the strip line is designed for vertical RF transmission. It was found that the center distance...
The heat generated by self-propagating exothermic reaction can be used to melt solder and then join the components. However, the microstructure of self-propagating interconnects is different from those obtained through traditional soldering process for its unique thermal conditions. In this paper, a finite element model was established to simulate the temperature field of self-propagating joints at...
In recent years, the Z-bending process was rarely investigated, especially for the asymmetrical Z-shape bending process. This causes the lacks of understanding on bending mechanism and spring-back characteristics and results in the difficulty in die design and process control for the spring-back characteristics. In the present research, therefore, the wiping asymmetrical Z-bending process was examined...
A novel and systematic methodology to predict the warpage of extremely thin packages is proposed. The geometrical and material inhomogeneities of both die and substrate are included in the prediction methodology. The inhomogeneous thermo-mechanical properties of dies due to the thermal incompatibility between silicon substrate and active/passive layers are inversely extracted from the Shadow Moiré...
Fan-out wafer level packaging technology becomes more attractive and popular in the semiconductor packaging industry. The fan-out wafer level package (FOWLP) has the feature of integrating various devices in a tiny form factor. Since the FOWLP size is compact and small, its package strength is critical to its reliability. In this work, the three-point bending test method and finite element method...
In this paper, finite element method (FEM) simulations are carried out with pillar-concave structure using silicon substrate, silicon substrate with polyimide (PI) and with polybenzoxazole (PBO) for realization of Cu-Cu bonding at low temperature. Parameters of bonding temperature, pillar diameter, concave sidewall angle, and multilayer of concave structure are all considered in simulation. In addition,...
Nowadays the comfort in passenger transport system is very relevant. One source of noise and vibration is the torque ripple. Torque ripple can be generated by an inappropriate machine control tuning and by the inherent torque ripple of the machine. In permanent magnet machines, the inherent torque ripple is composed by three components: electromagnetic torque, reluctant torque, caused by the winding...
Nowadays the majority of applications are demanding more and more compact, cost effective and robust solutions for their electric drives. In this context permanent magnet synchronous machines are considered as a good candidate due to their high torque density. This torque density is obtained thanks to high power rare earth magnets with both high remanence and high coercive force. However, the magnets...
In order to improve the piezoelectric stack displacement, this paper proposes a kind of piezoelectric flexible amplification mechanism based on lever principle with good linearity, high rotation accuracy and fast response. And the theoretical stiffness calculation is carried out, finite element model is established, the mechanism modal and displacement was calculated and simulated. Amplification ratio...
Based on practical problem in industrial ultrasonic cleaning, this research has an objective to simulate acoustic pressure leading to cavitation in a cleaning tank. By using Harmonic response in ANSYS as simulation software, acoustic pressure distribution has been simulated at different position in the cleaning tank. The result has been confirmed by aluminum foil corrosion test. The simulations show...
An integrated simulation solution in ANSYS Sim-plorer is presented for multi-scale and multi-domain simulation of electrical power systems. An accurate device-level power semiconductor modeling tool is introduced and verified. Reduced order model (ROM) techniques are then demonstrated to import detailed models from multiple ANSYS finite element analysis (FEA) tools, so they can be interconnected and...
In this paper the modifications of the RLC-circuit dimension reduction algorithm are considered, which provides less total number of newly created elements during the reduction process and, respectively, less time consumption and memory requirements for the circuit storage.
This paper explores the design, analysis and simulation of a high speed disk-type (axial flux) permanent magnet (AFPM) synchronous motor. This motor has rated power 0.5 hp at speed of 60,000 rpm used in some special industrial applications. The design of high speed AFPM motor is performed using analytical relations, and sizing of various components including dimensions, magnetic specifications and...
Developing an accurate dosage plan for radiation therapy is crucial to the success of the treatment, yet many obstacles still exist in spite of the application of the modern technology. One such challenge is revealed in registering CT scans and MRI images, that capture the location and geometry of the prostate. Due to bodily functions and breathing of the patients, the prostate moves with respect...
This paper presents the design, modelling, and finite-element analysis of a new flexure-based compliant rotary stage dedicated to precision micropositioning application. As compared with previous work, the designed new rotary stage offers a larger rotational angle and more compact size. Based on the established analytical models, the dominant parameters of the stage are determined to satisfy the performance...
The wafer-level package (WLP) was popularized to develop for mobile phones, tablets, portable players, wearable and IOT devices to fit small form factor and low profile benefits. Currently, WLP was demanded to increase I/O density and performance into applications with higher levels of integration. In order to develop the need for an evolution in functionality of WLP technology, WLP would suffer potential...
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