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With the development of marine industry, the requirements for safety and reliability of deep-sea operation equipment are getting higher and higher. Experimental test is an important part of detecting the performance of deep-sea operation equipment. The deep-sea pressure environment simulation device is used as a device to detect the performance of deep-sea operation equipment. The requirements of...
Word-line Batch Vth Modulation (WBVM) is proposed as a comprehensive solution for both write-hot and cold data to improve the reliability of Triple Level Cell (TLC) NAND Flash memories. For write-hot data, WBVM Vth score modulation decreases the program-disturb errors by 49% and enhances the endurance by 1.8-times of 2D-TLC NAND Flash. On the other hand, for write-cold data, WBVM BER score modulation...
Drop test for solder joint reliability is critical for all area arrays and perimeter-leaded surface mount semiconductor devices typically used in handheld electronic products. Joint Electron Device Engineering Council, JEDEC, published a new test standard, JESD22-B111A, to be the revision of the JESD22-B111 for board level drop test in November, 2016. The major differences between JESD22-B111 and...
Considering the increase in life expectancy in several countries, including Brazil, and that the average age of digital game players is 31 years, studies and the development of games for adults and senior people as their target audience become necessary. The objective of this paper is to provide the analysis of the impact of the use of Augmented Reality in games with adult users above 45 years. The...
With the rapid growth in the mobile industry, Package-on-Package (PoP) technology has been widely adopted for the 3D integration of logic and memory devices within mobile handsets and other portable multimedia products. The PoP solution offers significant advantages, including increased density through stacking logic and memory devices in the same formfactor and a high degree of flexibility for variable...
The capability to ensure reliability while operating in extreme environments is important for the most demanding automotive applications. Even though pressure sensors are a well-established area in the MEMS industry, improvements in sensor design are needed to deliver reliability and long operational life. This paper reports the design, fabrication and testing of a harsh media backside absolute piezoresistive...
Reliability of power electronics is a critical issue, as most of the electrical energy is processed by power electronics. Various stressors impact the safe operation of the systems, including harsh environments, temperature variations, humidity, vibration and radiation. Physics of failure analysis uses models that describe how failure mechanisms evolve over time and induce failures. Active methods...
A novel IGBT module construction using materials with matching coefficients of thermal expansion (CTEs) to provide longer lifetime and increased reliability will be presented. This technology reduces the stress on solder layers in the module, which tend to fatigue due to the module's flex during heat cycle tests. It will be shown that designs with matching CTEs also reduce the module's susceptibility...
Due to the continuous demands for highly reliable and cost-effective power conversion, the quantified reliability performances of the power electronics converter are becoming emerging needs. The existing reliability modelling approaches for the power electronics converter mainly focuses on the predictions of lifetime, accumulated damage, constant failure rate or Mean-Time-To-Failure (MTTF), while...
Silicon carbide (SiC) power MOSFETs have been becoming a strong alternative to silicon (Si) technology in high-voltage, high-frequency, and high-temperature applications. Despite their growing market share, limited field information is available regarding the aging facts under thermal stress and long term reliability of discrete SiC MOSFETs. In this paper, discrete SiC devices are thermally aged through...
Semiconductor power modules are widely used in machine drive applications. The temperature distribution in the power module is the result of load properties and the drive cooling. The temperature induced thermal-mechanical stress in the power module bond wires is critical for the power module reliability and lifetime. In this paper, a two level, three phase Silicon-Carbide (SiC) inverter power module...
A GaN-on-Si power device is a strong candidate to replace power components based on silicon in high-end market for low-voltage applications, thanks to its electrical characteristics. To maximize opportunities of the GaN device in field applications, a package technology plays an important role in a discrete GaN power device. A few specialized package technologies having very lower stray inductance...
This paper presents a reliability analysis and life testing of semiconductor devices for in-wheel motor (IWM) drive system in automotive applications. Considering practical factors such as vehicle lifetime requirements, a novel drive cycle is proposed to examine and assess the semiconductor reliability of a two IWM-driven vehicle. Based on the evaluated thermal profile of the device junction, the...
With the increasing penetration of wind power, reliable and cost-effective wind energy production are of more and more importance. As one of the promising configurations, the doubly-fed induction generator based partial-scale wind power converter is still dominating in the existing wind farms, and its reliability assessment is studied considering the annual wind profile. According to an electro-thermal...
ICs bonding reliability at High Temperature (HT) application is considered. Namely results of investigations of bond ball lift failure mode category at post HT stresses Wire Bond Pull (WBP) tests for AlAu intermetallic interface at Tamb>150degC are presented in submitted paper. Simplified model of reliability risk assessment on the base of impact of such input factors as application temperature,...
Tribology of renewable energy systems such as for wind turbines is a relatively new field and the study of which has a potential to reduce turbine component failures and turbine downtime. In this paper we focus on offshore wind turbines tribological issues in comparison to on-shore counterparts and address a coating deposition method which has potential to be used in wind turbine industry. In this...
A reliability study under high RF power stressing was conducted on two SiGe cascode Low Noise Amplifiers (LNA) using an in-house reliability tool. The first LNA was stressed at 19 dBm of RF power during 600 hours. Obtained results (relative degradation values in dB) showed a decrease of 11% in the small-signal gain (S21), while the second was stressed at 20 dBm of RF power during non-stop 600 hours...
Mechanical failures is most in all failures of circuit breaker. The mechanical reliability of circuit breaker is very crucial for power grid safety. In order to improve the mechanical reliability of circuit breaker, at the same time, in order to reduce costs and improve the competitiveness of products in the market, the mechanical reliability of circuit breaker needs to be studied. The dynamic behavior...
In this paper, we present an 880 MHz common-drain power amplifier (CDPA) in 130 nm CMOS technology. New PA topologies are required to address the issues of linearity, reliability, and efficiency. The CDPA is one such promising topology. Owing to the inherent feedback nature of a CDPA, the output voltage is a replica of input voltage, thus making the CDPA a highly linear amplifier with good efficiency...
In this paper, we present an 880 MHz common-drain power amplifier (CDPA) in 130 nm CMOS technology. New PA topologies are required to address the issues of linearity, reliability, and efficiency. The CDPA is one such promising topology. Owing to the inherent feedback nature of a CDPA, the output voltage is a replica of input voltage, thus making the CDPA a highly linear amplifier with good efficiency...
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