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Morphing is a technique that smoothly transforms a shape onto another. In this paper, we present a method for morphing of two dynamic meshes: mesh sequences representing the keyframes of animated shapes over time. The pipeline of the proposed method comprises two main stages: template-based cross-parameterization and dynamic mesh interpolation. In the cross-parameterization stage, we use a variation...
We optimized micro-holes in a thin slab for fast Si photodetectors at wavelength 800–950nm. Lateral modes are shown to be responsible for the effective light trapping. Small disorder and cone hole shapes helped achieve uniform quantum efficiency in a wide wavelength range.
Recently, interest in contents utilizing 360 and Virtual Reality images is increasing. These images are generally transformed into Equirectangular projection and transmitted in a 2:1 ratio rectangular shape. However, this method causes distortion of the upper and lower parts of the 360 images which is widely spread. Furthermore, since the spread 360 images requires higher data rate, it is difficult...
A finite element model which contains one sixth of the IGBT module based on a real test chip of IGBT module is established to investigate the temperature and stress distribution of different shape bonding wire. The finite element (FE) analysis which coupled electro-thermal and thermal-mechanical are conducted using commercial software ABAQUS. The thermal performance and stress distribution of IGBT...
Reduction of the polarization dependent loss (PDL) of 1.3 μm two dimensional grating coupler (2D-GC) was demonstrated by using slanted arrays and cross shaped scatterers. The PDL of 2D-GC was measured to be < 0.5 dB over a 40 nm range at 1.3 μm.
In this work, a p-Si field emitter array produced by wafer dicing is presented. Different strategies to produce a variety of shapes of the tips are shown. The resulting arrays show excellent emission characteristics compared to other field emitter, like carbon nano tubes.
3D Reconstruction of dynamic fluid surfaces is an open and challenging problem in computer vision. Unlike previous approaches that reconstruct each surface point independently and often return noisy depth maps, we propose a novel global optimization-based approach that recovers both depths and normals of all 3D points simultaneously. Using the traditional refraction stereo setup, we capture the wavy...
In this paper, we propose the mirror-symmetric Fano-like resonances which are generated by the interference between two resonant beam from through and drop ports of an add-drop microring resonator. While the path lengths of the two beams are different, small quasi-periodic spectral responses are nested in large periodic ones. The line shapes of the resonances are mirror images about the center wavelength...
In this paper, a two-dimensional photonic crystal based tunable optical filter having Si rods with different shape cavities, as H-shape, square and circular is designed and investigated. The shape of Si rods is also changed from circular to square and the shift in resonating frequency of filter is achieved. The area of each cavity has been kept constant for achieving the result. The filter is designed...
Atomic force microscope (AFM) cantilevers with integrated actuation and sensing provide several distinct advantages over conventional cantilever instrumentation such as clean frequency responses, the possibility of down-scaling and parallelization to cantilever arrays as well as the absence of optical interferences. However, for multifrequency AFM techniques involving higher eigenmodes of the cantilever,...
Inter-band tunneling in Si is a key mechanism for Esaki diodes and tunnel FETs. In nanoscale devices, the dopant states under high built-in electric field may significantly affect inter-band tunneling transport. Here, we introduce firsttime observations from measurements of nanoscale Si tunnel diodes of two main effects: (i) splitting of dopant minibands in high electric field, similarly to the Wannier-Stark...
In 3D IC technology, Through Silicon Via (TSV) is the primary medium used to distribute power and signal between layers of chips. Placement of a large number of TSVs in close vicinity leads to performance degradation due to interferences and crosstalk. The core of a TSV is usually circular column shape. In this paper, different shape for the core of the TSV is investigated to find the best possible...
This paper reports on the study of limitations of variable shaped electron beam lithography (EBL) as flexible high-resolution pattern generators for the fabrication of high quality photomasks required for many applications in sensors and microsystems development, including packaging applications. For this purpose, the case of 50×50 nm2 electron beam shape at 40 keV electron energy and a high-resolution...
We have recently shown that x-ray synchrotron-based B-Spline X-Ray Diffraction Imaging (B-XRDI), and laboratory-based X-Ray Diffraction (XRD) techniques, can be used to non-destructively and in situ evaluate die warpage and strain inside fully encapsulated chip packages. In this paper, we show that both synchrotron-based X-Ray Diffraction Imaging (XRDI) and laboratory-based XRD can be used to usefully...
We have designed and microfabricated millimeter-scale wing-shaped hybrid microstructures composed of rigid structures of single crystal silicon (SCS) and flexible polyimide (PI) membranes. The wing-shaped microstructures mimicking insect flapping flight have been designed using a fluid-structure interaction analysis, and have been microfabricated using microfabrication technologies with the SCS substrates...
We propose a new formulation of the active surface model in 3D. Instead of aligning a shape dictionary through the similarity transform, we consider more flexible affine transformations and introduce an alignment method that is unbiased in the sense that it implicitly constructs a common reference shape. Our formulation is expressed in the continuous domain and we provide an algorithm to exactly implement...
Through via formation is definitely the key for coming the advanced packaging which includes heterogeneous integration and high speed wireless communication. Glass and fused silica are well known as a great candidate for a core material for high frequency application as a result of high bulk resistance and lower dielectric loss. One of the important subjects in order to use through glass vias (TGV)...
Alpha particle-induced soft error rate (alpha-SER) of SRAM built in 10 nm FinFET on bulk technology was characterized. The 10 nm FinFET SRAM devices provide the alpha-SER improvement up to ∼46% comparing with 14 nm FinFET. The test result presents an alpha-SER with a small-sized alpha source for the supply voltage, SRAM design, incident angle, and MCU dependencies. The SER characteristics with small-sized...
Shared Nearest Neighbor (SNN) Clustering is a well-established density based clustering algorithm, which can find clusters of different sizes, shapes, and densities. SNN has been widely adopted in numerous applications. As the size of dataset becomes extremely large nowadays, it is inefficient or even impossible for large-scale data to be stored and processed on a single machine. Therefore, the scalability...
Polyp identification in human Gastro Intestinal (GI) Tract employing endoscopy and colonoscopy through various computer vision and image processing techniques has achieved lot of success and maturity in its field. Over the last decade Wireless Capsule Endoscopy (WCE) has emerged as an innovative diagnostic system for identification of ailments such as polyps in GI tract. Polyp detection through WCE...
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