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Nanostructured pristine lead sulfide and copper iodide semiconductor films as well as copper doped lead sulfide and iodine-enriched copper iodide layers were obtained on solid and flexible substrates via Chemical Bath Deposition (CBD) and Successive Ionic Layer Adsorption and Reaction (SILAR) methods. Crystal structures, optical, electric and thermoelectric properties of the layers have been studied...
The plasma activation is a promised process to improve the bonding performance for materials pretreated with the plasma. In this study, the chips studded with gold bumps flipped-bonding onto alumina substrates using the thermal compressional bonding. To improve the bonding performance of gold bumps onto copper electrodes, both gold bumps and alumina substrates were pretreated to Ar/H2 plasma at 400...
The following paper will sketch a novel method of how to avoid lead in the module and at the same time enhance the module's efficiency with Light Capturing Ribbons (LCR). Additionally, the new process will show a way to reduce the silver content of crystalline PV modules. The key idea is the application of conductive adhesives. The main result of the project was to prove the ageing behaviour compared...
Due to a weak adhesion, the delamination occurred frequently in the interface between the epoxy compounds and lead that results in a performance failure normally. Several treatments, such as plasma and chemical modifications, have been developed and applied to enhance the bonding force in the interface of both materials. In this study, an anchor shape of the lead, as a mechanical locking microstructure,...
The next generation of switches for power electronics is based upon Wide Band Gap semiconductors (WBG), e.g. GaN or SiC. These materials are supporting the possibility of higher switching currents and high frequency applications. Wide band gap semiconductors enable high voltage and high temperature applications. Power electronics need an optimized low inductive commutation cell for reducing the switching...
Laminate chip embedding tailored to very thin dies is an attractive package technology for the integration of logic and power dies. In this paper we report on a new leadframe based laminate chip embedding technology. Best benefit from this technology can only be achieved if experience from silicon front-end, assembly and packaging, as well as from printed circuit board research is combined and consequently...
The number of in-vehicle power devices has been increasingly for motor controlling purposes. Power device packages should ideally be small and easy to mount. We have developed a small power module by assembling several power devices sealed with molding resin. Two new techniques were used to produce this module: one was the use of copper clips for high-current wiring, and the other was low-cost soldering...
Stitch crack is a recurring failure mechanism for many years in semiconductor packaging. Currently, the combination of highly filled mold compounds, and copper wire increases the risk for stitch cracks after temperature cycling (TC). Firstly, highly filled mold compounds generally have a Coefficient of Thermal Expansion (CTE) that is much lower than that of copper, and a much higher elastic modulus...
Electronic components are increasingly used in high temperature environments like automotive, deep drilling technology and aerospace applications. [1] For these applications, miniaturization is gaining importance so that traditional methods and materials encounter their limits. Furthermore, regarding miniaturization and increase of the functional density, electronic and mechanical components have...
Recently, copper wires have been attracting much attention for LSI (Large Scale Integration) bonding because of its excellent mechanical and electrical properties, and low material cost. On the other hand, the end of these wires are usually joined to the pads or through-holes on the printed circuit board, and lead-free soldering is one of the popular bonding methods. Since the solders are weaker than...
This paper focuses on energy efficiency of device-to-device (D2D) underlay massive multiple-input multiple-output (MIMO) hybrid networks with power beacons (PBs). The D2D transmitters harvest the energy from the signals of dedicated power beacons, but also the ambient radio frequency (RF) interference of cellular users (CUs). The inverse power control schemes are employed at D2D transmitters. For...
Sintered Ag has gained attention as a replacement for high lead applications due to its high thermal, electrical and reliability performance. Today, the temperature requirements for certain business units require higher levels of capability. Coupled with the pressures of converting to lead free, a feasible solution needs to be reached soon. This led to the formation of the DA5 (die attach 5) consortium...
The paper conducts a simulation analysis on the electric field contribution of leading-out terminal based on the long running semi-insulating switchgear. The electric field distribution of leading-out terminal is obtained by using electrostatic field analysis with the software, ANSYS. The effects of water and dust are simulated by changing the dielectric constant of air considering the unpurified...
In copper leadframe fabrication process, anti-oxidant agent is a common chemical solution used to easily protect oxidize surface like copper bond pad surface. There are varieties of anti-oxidant solution available in the market. However, only certain group of anti-oxidant chemical solution can be applied on the copper leadframe or bond pad surface. This is mainly due to the specific and unique anti-tarnish...
With the Copper wire bonding already occupying majority of production lines, there are many significant factors continue to surface out. The Copper wire bonding has also becomes very susceptible to production variability of small leaded packages such as Thin Small Outline Package (TSOP). The TSOP utilizes thin and flimsy leadframes, causing a lot challenges at 2nd bond (stitch). The stitch bonding...
This paper presents a novel approach to embed power semiconductor devices into a printed circuit board. Here, IGBTs and diodes with reinforced top side chip contact are used in an IGBT half bridge with 25 A / 1200 V rating. Thermal simulations highlight the improved thermal impedance caused by the reinforced top contact and the benefits of the insulated copper substrate compared to a commercial DBC-based...
Packages of power semiconductors have considerable influence regarding the thermal impedance, the parasitic inductance, which affects the switching losses, and the reliability. In this paper, the performance of a phase leg of a PFC rectifier with PCB embedded power semiconductors is investigated. The mechanical stress in the PCB is analyzed by a FEM simulation and PCB design guidelines are given....
The effects of thermal aging and electromigration on the tensile strength and microstructure of SnAgCu micro-interconnection solder joints with different volume were discussed in this paper. The experimental results show that isothermal aging results in coarsening of the microstructure in the solder joint, and electromigration leads to micro-hole or micro-crack in the cathode interface, which bring...
This paper presents a wafer-level fabrication process of 3D power module based on 8-inch wafer devices and 8-inch metallic bulk leadframe. This approach relies on the intermixing of the packaging process with the front-end fabrication of the power devices. The specific processes to obtain functional power devices and the metallic bulk leadframe manufacturing are described in the paper as essential...
This paper reviews the development of chip rework processes at IBM, from leaded bumps on ceramics to lead-free on organic carriers, with emphasis on the latter. Traditionally, when fabricating high performance multichip ceramic modules, the ability to remove one or several chips after testing the fully populated module becomes important in ensuring that it has a full complement of functioning chips...
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