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An integrated reset controller (voltage supervisor) is designed and implemented. The system generates a reset signal, active while power supply brownout conditions are detected and for 250 ms after the supply voltage has increased to acceptable levels. The circuit is built in a Deep N-Well (DNW) 5V 0.35μm CMOS process, which provides good isolation between the on-chip devices and the substrate. The...
Lateral GaN-on-Si HEMT technology enables integrated high-voltage half-bridges with gate drivers. However, the capacitive coupling through a common conductive substrate influences switching characteristics. The measured hard-switching turn-on time with floating substrate increased to over 16 ns as compared to conventional source-connected substrate (1 ns), switching 300 V/4A with GaN ICs comprising...
This paper describes an accurate circuit model that accounts for the working principles behind the operation of a recently demonstrated planar resonant blazed grating. The strictly planar grating is a simple array of metal strips printed on a conductor-backed substrate. The circuit model provides an analytical description of the perfect blazing caused by resonance in an infinite grating of this kind...
In this paper, a 620–690GHz sub-harmonic mixer using monolithic GaAs integrated schottky diodes is presented in order to remove the mismatch caused by manual assembly of the flip chip diode. The monolithic microwave integrated circuit integrates a Schottky anti-parallel diodes pair in a longitudinal configuration. We mostly analyzed the influence caused by diode position offset and conductive adhesive...
This work investigates the properties of conductive circuits inkjet-printed onto the polycarbonate discs used in CD-based centrifugal microfluidics, contributing towards rapidly prototyped electronic systems in smart ubiquitous biosensors, which require sensitive and robust signal readout at low power and cost, and with wireless connectivity. A protocol for inkjet-printing electronic networks on CD...
This paper describes the results of evaluation and simulation modeling of the influence of a silicon substrate propagation disturbance on circuit operation in silicon-on-insulator BCD (BIPOLAR/CMOS/LDMOS) process. In the evaluation, the susceptibility of the Widlar bandgap voltage reference (BGR) to a disturbance propagating from the substrate is measured by direct RF power injection tests in the...
A method for interactive initial placement of Integrated Circuits (IC's) cells is provided. The method is based on multi-parameter criterion placement with customizable coefficients of importance for private criterion together with simulation of thermal field of IC substrate. Graphical user interface (GUI) is provided for thermal field modeling, equipped with a set of abilities for designing which...
Automotive electronic units need to comply fully with electromagnetic compatibility (EMC) regulations. This paper proposes a comprehensive simulation methodology and techniques for analyzing EMC performance of integrated circuits (ICs) in chip-package-system (CPS) board integration. Extended chip power models (ECPMs) model automotive ICs for noise emission (EMI) and also for noise susceptibility (EMS),...
A method of modeling of thermal field of substrate of semiconductor integrated circuits (IC), based on similarities of thermal and electric processes is proposed. Based on the proposed method, corresponding electrical circuit of IC heat exchanger, which consists of current source and resistance, is built. The commercial software modeling tool HSpice has been used for model implementation. The effectiveness...
With the rapid increase in the number of integrated circuits I/O, the traditional wire bonding package has been unable to meet the high I/O number of interconnection needs, flip-chip process can undoubtedly solve the high I/O number of miniaturization package problems, especially flip-chip plastic package can fundamentally meet the increasing number of pins, improve speed and high frequency performance,...
Forward body bias method for evaluating total ionizing dose (TID) effect in deep sub-micron CMOS integrated circuits is proposed. Without traditionally complicated, time consuming and costly transistor radiation modeling or chip irradiation test, it is demonstrated here that by applying equivalent forward body bias on susceptible NMOS transistors, TID effect evaluation for deep sub-micron CMOS ICs...
Advanced power module packaging technology is currently being heavily investigated to take full advantage of Wide Band Gap (WBG) power semiconductor devices. As one of most widely applied power module technologies, intelligent power modules, typically for automotive industries, work well to achieve higher operating frequencies with lower losses by integrating gate driver circuits with power semiconductor...
This paper proposes a point-to-point modeling scheme for Spice-based circuit simulation of parasitic coupling effects caused by minority carrier injection into the substrate of a deep-trench based BCD technology. Since minority carriers can diffuse over large distances in the common substrate and disturb circuits in their normal operation, a quantitative approach is necessary to address this parasitic...
A scattering matrix subtraction method is employed within the mode-matching technique (MMT) to model right-angle substrate integrated waveguide (SIW) junctions. The advantage of this approach lies in the fact that generalized scattering matrices of inline SIW waveguide circuits, including simple bi- and trifurcations are computed first. In a second step, the scattering matrices of regular waveguide...
New electronic devices with small size and low power consumption are in demand in recent years. Miniaturization and complex product are required in modern electronics for more functionality in the smaller electronic package. To overcome such issues, 3D packages or package on package (PoP) are introduced. The 3D packaging is stacking of chip on top of another which is emerging as a powerful technology...
A practical approach for the design and optimization of substrate integrated coaxial filters is presented in this work. The technique is based on the electromagnetic optimization of the 3D filter by using a circuit-level model of the structure. As an example, a 6-pole filter with quasi-elliptic response and tight requirements in terms of group delay flatness has been designed, manufactured and measured...
We propose a new rectifier for microwave wireless power transfer using a multilayer substrate filter as an output filter. First, we designed three and four layer substrate filters with a electromagnetic field simulator and obtained their filtering characteristics. Next, we applied each multilayer substrate filters designed above to an output filter of rectifier and simulated its rectification efficiency.
An experimental analysis is presented spotlighting the performance differences of horizontal and vertical mounting of multilayer ceramic capacitors (MLCC) on a PCB in electronic design and simulation. The MLCC performance depends on the orientation of the electrode plates with reference to the ground plane. The measurement of capacitor vertically mounted eliminates the odd-numbered parallel resonances...
A new type of novel high voltage IGBT module package with a 140mm×100mm footprint half-bridge has been developed. The module aims to provide the market a new type of high power density, high reliability standardised package. The module is scalable and suitable for multi-module parallel connection without degradation, is a low inductance design for both the internal structure and external connection,...
This paper introduces a miniaturized antenna structure with a complex substrate, which is composed with CER-10 and meta-material. This complex substrate influences to the impedance value of antenna system, then this can make the antenna size reduction. The proposed antenna structure reduces the conventional antenna size by 66.7 % with respect to pure meta-material substrate reduction rate of 40 %...
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