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Sn-3.0Ag-0.5Cu lead-free solder, PCB copper clad laminate and copper thin film substrate were used as experimental materials and the Cu/SAC305/Cu interconnection plate-level structure micro-solder joint was prepared by pulsed hot-pressing welding test. The author aimed at investigating the pulse welding time, pulse welding temperature and welding pressure which influence on the microstructure of solder...
High bandwidth Package on Package (HBPoP) had be well used which replaced FCMAPPOP in high-end mobile products with its advantages of wide I/O counts, high performance and the better integration between application processor and stacked memory packages. The structure of HBPoP is utilized flip-chip technology with ball grid array (BGA) balls on the bottom package and connect top DRAM package with substrate...
Ultrasonic cleaner is a workhorse in all failure analysis labs for residue removal after decapsulation or etching. In this paper, we present a novel method of ultrasonic decapsulation, where acid mixture was used in conjunction with ultrasonic agitation and was discovered to provide exceptionally high quality preservation of the surface of the copper bond wires which exceeds the quality of laser decap...
The paper explains the relation between prosodic phrases and Information Structure (IS) by decomposing phrases into hierarchies of embedded contrast/communicative units (CUs). At any level of hierarchies, CUs contains IS partitions supported by two contrasted functional constituents. The functional categories are defined by using a two level IS model. Topic-Focus and CU_predicate-CU_argument are the...
Handheld consumer electronics are requiring more complex packaging designs to accommodate higher component densities and reduce form factor. Fan-out wafer-level packaging (FOWLP) has garnered much attention lately as a cost-effective way to achieve high interconnect density and manage larger I/O counts within an affordable package. Two principal approaches to manufacturing FOWLP components have evolved:...
Emerging fan-out packages require advances in mold compounds, polymer interfaces to metals and silicon, and innovative processing to reach the required high reliability. In this paper, we discuss the fracture energy for mold compound interface to copper and silicon, and use that information for studying interfacial delamination propagation of mold compound. We have examined mold compound delamination...
Various readily available powdered materials were examined in order to determine their usefulness for removal of common electrical potting materials via microabrasive media blasting. Each blasting media was tested against five different potting materials, and was additionally characterized in terms of mechanical and triboelectric properties. Additional work has been cited that lends credence to the...
Stitch crack is a recurring failure mechanism for many years in semiconductor packaging. Currently, the combination of highly filled mold compounds, and copper wire increases the risk for stitch cracks after temperature cycling (TC). Firstly, highly filled mold compounds generally have a Coefficient of Thermal Expansion (CTE) that is much lower than that of copper, and a much higher elastic modulus...
The performance and power efficiency of high-end servers benefit from dense system integration. Accordingly, we introduce a scalable packaging platform supporting high-performance chip stacks, as a continuation in server-system density scaling.
While the density of copper line pitch of substrate has faced a significant challenge, such as photo resist mold of 20μm pitch line, for manufacturers over the past decade, the subtractive method can be overcome by using semi-additive method. However, subtractive method is cost effective and most widely used on copper line formation, and then an emergent need of a significant change at substrate level...
Copper wire has been popular in these years when facing ever-increasing gold prices. The success of large scale conversion of gold to copper wire in microelectronics could achieve successfully when all the failure mechanisms that can be discerned during reliability testing. One of these mechanisms is corrosion of the contact between the copper (Cu) ball and the aluminum (Al) bond pad, consisting of...
Conformal plating on mold compound is a new fabrication process technology, it offers new possibility for IC package design to improve features such as rigidization of the flexible core, heat sinking, 3D circuit patterning and EMI shielding. This fabrication technology had successfully demostrated a process which is able to achieve high reliable performance, as being proven to have high peeling strength...
Opportunities and challenges of copper wire bonding implementation in the automotive context are presented from two different viewpoints: manufacturability and reliability. Compared to gold, copper offers better thermal and electrical properties, but its higher hardness imposes a tighter process control and a dedicated approach to process setup, optimization and validation. Compatibility with the...
In this study, a nanowire crossbar Si3N4/SiO2 bi-layer resistive random access memory (ReRAM) with copper (Cu) electrode has been fabricated successfully by a Cu chemical displacement technique (Cu-CDT). The Cu-CDT could overcome the difficulties of Cu dry etching and achieve a high density crossbar array of Cu-based ReRAM. Compared with other Cu deposition techniques, Cu-CDT exhibits several advantages...
The study presents the results of experimental investigation of finding out the limit concentrations of DBDS and sulfur mercaptan for safe and prolonged operation of power transformers in the local environmental conditions of Saudi Arabia. For experimental investigation of limit concentrations of DBDS and sulfur mercaptan, new oil free of sulfur compounds was acquired. Four specimens of this were...
In recent years, Ag alloy wire has attracted great interest as a novel bonding material to replace the conventional Au wire bonding. Ag wire has the advantages of great workability, high electrical conductivity and low growth rate of intermetallic compound at bonding interface. However, in literatures, studies on mechanisms of the growth of Ag-Al intermetallic compounds and their impact on bonding...
Reduction of development time of an advanced Electronic Control Unit (ECU) requires optimization of the product design at the early stage of development. A simulation-driven design has been used effectively to define the ideal position of components for optimum reliability even before the first prototype is manufactured. Such methods are based on a virtual design of experiments that allows to investigate...
IC packages using mold compounds with low coefficient of thermal expansion (CTE) have been introduced in the last decade packages with basically no attention to its impact on board level reliability. In this study, the impact is shown for a large size QFN package. In this parameter sensitivity study, also the solder composition and the flank wettability of the QFN leads are varied. The QFN's soldered...
Recent years many technical papers had discussed a lot on copper wire boned devices reliability by conducting various reliability tests [1, 2]. The most common failure analysis methods used are cross section, SEM and FIB to study the IMC growth and acid decapsulation to remove the mold compound to inspect die surface [1]. Usually wire pull and ball shear test were used to evaluate the wire and ball...
The purpose of this research is to confirm that domestic database, in the case of J-GLOBAL, will be able to be used for strategies of science and technology in the same way as global database, such as Web of Science. Domestic databases have potentials to provide unique cutting edges, due to the custom of presenting it in local conferences before publishing it in global academic journal. In addition,...
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