The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
In this study, we perform a top gate field effect transistor by using the integration of novel materials such as graphene as active channel and fluorinated graphene as dielectrics on flexible Polyethylene terephthalate (PET) substrate. These device shows high carrier mobility (∼969 cm2/v.s) at a drain bias of +0.5V. It shows good mechanical flexibility and electrical stability after bending measurement...
Resistive switching memory devices is a promising candidate for next generation data storage. The use of nontoxic and natural available biomaterials are prospective building block for environment friendly, biocompatible and biodegradable electronic devices. The fabrication and characterization of protein based Al/Azurin/ITO/PET flexible memory device is presented here. We observed significant bistable...
Embedding technology enables miniaturisation of electric and electronic components together with improved reliability and thermal stability in harsh environment. This work investigates in form of single case studies the environmental performance from cradle-to-gate of two new designed and fabricated power modules for electric vehicle application with the method of the Sustainable Process Index (SPI)...
Given the recent interest in power delivery design for the Internet of Things (IoT), current work aims to design a packaged power delivery solution for IoT. The power inductor takes up a large amount of the area in such an implementation. Planar power inductors are preferred for fabrication simplicity and cost. However, air core inductors do not have sufficient area efficiency for IoT solutions, necessitating...
In this study dry film photoresist material is employed to fabricate thicker Cu pillars and solder interconnects. The development of the dry film photoresist process for forming 200 µm thick copper pillar were introduced. Several experiments were conducted to find the optimized process parameters for the dry film photoresist. A Laminator was adopted to laminate the dry film. The lamination temperature...
This paper presents the design, simulation, and characterization of metamaterial-inspired terahertz filters, fabricated by aerosol-jet printing. Filters are designed for operation at 230, 245, and 510 GHz, for both band-pass and bandstop operation. Operation of each printed filter is compared to structures fabricated from copper metal using a photolithographic process. Each of the aerosol jet printed...
Despite their low profile and competitive radiation characteristics, most of the devices in the corrugated leaky wave antenna family feature an unnecessary excess weight which result detrimental for current innovative applications, such as unmanned aerial vehicles (UAV), aircrafts or satellite antennas. Stereolitography, accompanied by plating, is presented as an economic and fast solution for the...
Thin film copper membranes on silicon substrates were constructed using micromachining techniques. Membranes were used as flexible ground planes beneath a microstrip transmission line. Actuation of membranes induced phase shift in the transmitted signal. Membranes possessed radial surface corrugations 10 μm deep to increase their flexibility. Membranes were released using a combination of KOH and...
In this paper, a Lab on PCB (LOP) for conditioning the medium of cell culture is presented. The target is to control its temperature at 37 °C ± 0.1 °C, to assure the appropriate temperature conditions around the cells. The Lab on PCB is also able to mix other fluids into the medium, if it is necessary. The integration of a PDMS microfluidic circuit over a Printed Circuit Board (PCB) results in a smart...
The Horizon 2020 TWEETHER project is proposing for the first time a millimeter wave traveling wave tube (TWT) as enabling device for a new generation of high data rate wireless networks for point to multipoint. The W-band is an unused portion of the spectrum comprised in the range 92–95 GHz that offers multigigabit data rate. The distribution of the signal over a wide area and the strong atmospheric...
This paper presents a novel approach to embed power semiconductor devices into a printed circuit board. Here, IGBTs and diodes with reinforced top side chip contact are used in an IGBT half bridge with 25 A / 1200 V rating. Thermal simulations highlight the improved thermal impedance caused by the reinforced top contact and the benefits of the insulated copper substrate compared to a commercial DBC-based...
Photoacoustic (PA) imaging employs a pulsed laser to generate acoustic waves to be detected with a piezoelectric transducer. A coaxial, or even confocal, optical-acoustic arrangement has been desired to achieve high resolution and high sensitivity PA imaging. This research reports several designs and fabrications of sol-gel based PZT/PZT single-element transducers for coaxial PA imaging. At first,...
With advent of microelectronics, power requirement is reduced to greater extend which makes microsystems self powered. Hence, Energy Harvesting domain becomes center of attraction of worldwide researchers. It is possible to harvest the energy from the ambient sources which are freely available in surrounding and use this harvested energy to power the miniaturized devices which require microwatt power...
Localized electrochemical deposition (LECD) is a metallic microfeature manufacture technology that uses tiny simple electrode to plate in the cathode. Compared with other conventional lithography employed in the semiconductor industry, LECD has the advantage of simple operation and low cost, and it is particularly suitable for manufacturing some precise metal components that have high aspect ratio...
A frequency selective surface is implemented without using a substrate. It is fabricated in the lab by only using a commercial copper sheet. This novel method of implementation is introduced due to three benefits. First, the reduced cost due to simplicity of fabrication. Second, the frequency selective surface could be easily bent to cover curved edges and complex geometries. Three, the substrate...
In this paper, two approaches in fabricating textile antennas with double-layer embroidery technique, as one of the way to increase the textile antennas' efficiency, are discussed and compared. In the first approach, a conductive thread is used for both the upper and lower (bobbin) threads, while in the second, the conductive thread is used only for the lower thread but the embroidery process is done...
The loss of the folded waveguide structure plays a key role in the design of 220 GHz and 340 GHz TWTs. It can only be derived from experiments so far since both theory and empirical data are limited. Folded waveguide structures of 220 GHz and 340 GHz have been fabricated and tested. The experimental effective conductivity is 2.1–2.8×107 S/m at 220 GHz and 1.9–2.4×107 S/m at 340 GHz, respectively.
Fabrication of slow-wave circuits for TWTs is challenging at frequencies in the upper millimeter-wave range, due to size and geometry limitations of available methods. We describe fabrication techniques being developed for mmW circuits based on microfabrication and additive manufacturing. We present progress on W-band serpentine waveguide circuits fabricated by UV-LIGA, 3D printing, and CNC machining.
This paper reports a new approach for fabrication of high-aspect ratio low resistance vertical interconnects, providing an electrical interface between the front-side and the backside of the Silicon-on-Insulator (SOI) wafer. The method of Thru-Wafer Interconnects for Double-Sided (TWIDS) fabrication of MEMS is based on seedless copper electroplating, and allows for voids free features and high aspect...
We demonstrated the fabrication of individual freestanding graphene edge probes. Graphene was prepared by thermal CVD with solid carbon sources. A Cu wire was act as the substrate for graphene growth. Follow the structure process from a micromanipulator and an optical microscope, the freestanding graphene probes was fabricated. The electron emission pattern from the graphene edge was observed, and...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.