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The joints of Au60AgCu alloy to silver and copper plated wire were obtained by using Sn63Pb solder, and the microstructure and mechanical properties of the brazing joints were investigated. The shear strength and the reliability of joints after the high and low temperature test were evaluated in this study.
Sn-3.0Ag-0.5Cu lead-free solder, PCB copper clad laminate and copper thin film substrate were used as experimental materials and the Cu/SAC305/Cu interconnection plate-level structure micro-solder joint was prepared by pulsed hot-pressing welding test. The author aimed at investigating the pulse welding time, pulse welding temperature and welding pressure which influence on the microstructure of solder...
Due to a weak adhesion, the delamination occurred frequently in the interface between the epoxy compounds and lead that results in a performance failure normally. Several treatments, such as plasma and chemical modifications, have been developed and applied to enhance the bonding force in the interface of both materials. In this study, an anchor shape of the lead, as a mechanical locking microstructure,...
This paper presents the relations between processing, microstructure and mechanical reliability of copper pillar bumps (CuPi). Two sets of samples were manufactured: Cu/SnAg and Cu/Ni/SnAg with diameters between 15 and 20 µm. From the microstructure point of view: at these dimensions and for simulated reflows, up to 5, intermetallic compounds (IMC) follow a classical power law with a time exponent...
Wide band gap semiconductors have becomevery attractive for power electronics because of their excellentproperties at high power and high junction temperaturesabove 300°C. However, the maximum operation temperaturesof conventional packaging materials, like tin-based solders oreven tin-lead solders, are limited to around 220°C. Thus, a newpackaging material with a higher melting temperature must bedeveloped...
The reliability of copper through-silicon vias (TSVs) has been shown to be largely determined by the microstructure and extrusion statistics, and the mechanism for this requires further investigation. Synchrotron x-ray microdiffraction is an advantageous technique for TSV measurements due to its high beam intensity, which allows for full stress derivation with submicron resolution, and its nondestructive...
Microstructure variation with post-patterning dielectric aspect ratio (AR) and post-plating annealing temperature has been investigated in Cu narrow wires. As compared to the conventional annealing at 100 ◦C for a feature AR of 2.6, both elevated temperature anneals and reduced AR structures modulated Cu microstructure, which then resulted in a reduced rate of electrical resistivity increase with...
Dissimilar metal joining methods are essential for the manufacturing of a various structures and parts in the industries. Friction stir spot welding process was performed on 3 mm thick AA1060 and C11000. This paper presents the results on the microstructure, chemical analysis and electrical resistivities of the produced joints. The microstructure showed a contrast between the two different materials...
Increasing demands for higher energy efficiency and operating at harsh environments lead to the development of new compact power electronics, which is complemented by new interconnection technologies. Investigations were made on a planar copper interconnection technology. The characteristic difference to other technologies can be seen in the replacement of bonding wires by planar copper interconnects...
For vacuum brazing applications Hermetic Sealing Materials (HSM) with low partial pressure are widely used to join copper or stainless steel parts. For joining copper AgCu28 is a widespread material, which is well characterized and investigated. For stainless steel, AgCu28Ge2Co0.3 is commonly used if the same brazing temperature as AgCu28 is required. Umicore Technical Materials has developed a new...
Diamond-Cu matrix composite with high thermal conductivity and low coefficient of thermal expansion has been the high-performance thermal management materials. High-performance copper-coated diamond composite powders were successfully prepared using electroless plating at an appropriate bath temperature, pH value, copper ions concentration. The XRD results showed the coated Cu was highly pure with...
This paper considers the control of the grain growth in a copper thin film using a multi-zone micro heater array. The overall system is a multi-input/multi-output (MIMO) control system: currents of 10 micro heaters as input and local microstructure (mean grain sizes) as output. We develop a biased Monte-Carlo (MC) model to simulate complete microstructure evolution in response to the temperature field...
The influence of cobalt (II) chloride on laser-induced copper deposition was studied. Copper deposition experiments in aqueous solutions containing various concentrations of cobalt (II) chloride upon 532 laser irradiation were performed. The influence of additives on the deposition rate, the topology, electrochemical properties of the deposited microstructures was investigated. Sensory activity of...
Four level sets of current density and additive concentration are used to electroplate copper into the through silicon via to prepare four sets of test samples. Each set of samples are annealed at 425°C for 30min. The Cu-Si interface of the TSV structure and the copper microstructure are observed before and after annealing, and the copper protrusion is measured after annealing. Effects of the electroplating...
Theoretical analyses on the thermo-mechanical behavior of power modules designed in a new buildup and interconnection technology based on silver sintering and electroplated copper interconnects have been made. The characteristic difference to other technologies can be seen in the replacement of bonding wires by planar copper interconnects and the high voltage applicability of the resulting modules...
Copper in spite of being face centered cubic crystal has significant mechanical anisotropy. The elastic constants of copper vary considerably for different crystallographic orientations. Typically, the copper metal conductor lines in integrated circuits are polycrystalline in nature. The polycrystalline microstructure is known to impact the reliability and is yet to be thoroughly understood. In this...
In recent years, a great interest has emerged in the development of new wafer-scale assembly processes. Beside the mechanical strength required, some applications need a vertical conductivity leading to implement metal thin films as bonding layers. For its interesting properties in terms of resistivity and reliability, copper has been already used in metal-metal direct bonding configuration. Initially...
In this study, we evaluate the application of copper nanoparticles as a low temperature bonded interconnection. The copper nanoparticles have an organic passivation layer which stabilizes them, preventing spontaneous particle fusion and growth at ambient temperatures, as well as avoiding oxidation before its usage. Thermogravimetric analysis and differential scanning calorimetry show that the solvents...
Understanding the spatial composition inhomogeneity in CIGS solar cells can provide insight into a potentially large cause of decreased cell efficiency. We used synchrotron based nano x-ray fluorescence and nano x-ray beam induduced current to investigate the correlation between grain-to-grain compositional variations in Cu(In,Ga)Se2 absorber layers and variations in carrier collection efficiency...
In this paper two different structures that reproduce crucial aspects of interconnect design are studied extensively. The purpose is to evaluate the effect of these configurations on the electromigration degradation in order to provide lifetime quantitative design rules. Taking into account these configurations will increase the accuracy of reliability prediction at design level and help designers...
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