The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
The capability to ensure reliability while operating in extreme environments is important for the most demanding automotive applications. Even though pressure sensors are a well-established area in the MEMS industry, improvements in sensor design are needed to deliver reliability and long operational life. This paper reports the design, fabrication and testing of a harsh media backside absolute piezoresistive...
In this study, the influence of a temperature annealing process on the crystallographic orientation and sheet resistance of Pt/Ti films is investigated. Varying parameters are the annealing temperatures ranging between 450°C and 700°C and the atmosphere of the annealing process, which consists of either air, forming gas and argon gas. The thickness of the Pt/Ti film and the time of the annealing process...
A novel vibrating ring gyroscope is proposed in this paper, and the structure employs axisymmetric ring resonator and capacitance transducers. Motion characteristics of the ring resonator and the setting of the capacitance electrodes are discussed in detail. The simulation results demonstrate that the natural resonant frequency of the operating mode of the gyroscope is 8.805 kHz and 8.807 kHz, and...
The MEMS (Micro-Electro-Mechanical Systems) acronym recalls mechanical structures of micrometric dimensions performing a well-controlled electronically preset function. The real sense of a microelectromechanical system (MEMS) is the interaction of electronic circuits with the mechanical transducers (microstructures) to perform a useful function. However, the MEMS-microstructures require a wide range...
The design, fabrication and testing of a novel resonant accelerometer integrated with a temperature sensor is presented in this paper. The accelerometer consists of double quartz resonators and a silicon substrate. A novel diamond like carbon (DLC) film with special electrical property, excellent mechanical property and chemical stability, which has negative temperature coefficient of resistance (TCR),...
This paper presents the integration of piezoelectrically actuated flexural plate wave devices in a custom designed fluidic cell for biosensing in liquid. The flexural plate wave devices have a wavelength of 60 μm with an antisymmetric A0 mode analytically predicted to occur at 45MHz. The flexural plate wave devices and fluidic cell are used to measure protein adsorption from solution. As a biosensing...
This paper proposes a terahertz(THz) circularly polarized quasi-diagonal horn antenna, which is composed of several etched silicon layers. Through adding the antipodal transition structure, we can obtain good circular polarization performance. The simulated result reveals that the bandwidth for axial ratio below 2dB from 490 GHz to 500 GHz. The return loss below −23dB from 490GHz to 500GHz. Good symmetric...
We present a fabrication procedure for batch production of MEMS devices directly on top of an optical fiber. Here, the stepwise fabrication procedure is described and the performance of the final device is demonstrated.
A simulation analysis of a porous nanocrystalline silicon membrane (pnc-Si) is conducted to investigate the mechanical properties of the membrane in an assumed environment of an artificial kidney, with an applied pressure ranging from 10–500 mmHg. The simulation was done using COMSOL Multiphysics 5.1 under stationary study with the membrane having a variation of surface area. From simulation, the...
Thermal wind sensor has been used to measure wind speed and direction in high temperature due to its principle. In this paper, a novel structure is proposed. It consists of a silicon sensing substrate and a ceramic chip for packaging, in which the sensing chip with through silicon vias (TSV) is Cu-Sn eutectic bonded to the ceramic. This paper focuses on the thermal-mechanical reliability of the novel...
We take this opportunity to introduce our research and development effort on MEMS-based dynamic x-ray optics that exploit the properties to manipulate and control the x-ray pulses at synchrotron sources for time-resolved experiments.
This paper presents an investigation on combined surface modifications and their effects to tribological properties of Si (100) flat surfaces. At first, micro-patterns were fabricated on Si wafers using photolithography and DRIE (Deep Reactive Ion Etching) fabrication techniques. The patterns include of pillars and channels shape in micro-scales. Secondly, the Si micro-patterns were coated by thin...
Distinct from conventional diaphragm-type pressure sensors, a bulk-type silicon-based pressure sensor is proposed and demonstrated. External hydrostatic pressure acting on the sensor is converted to biaxial compression inside an all-silicon encapsulated vacuum cavity, and measured using four piezoresistors oriented to optimally utilize the anisotropy of silicon piezoresistance. Limited only by the...
We directly compare both the process and in-use stiction properties of two identical sets of devices fabricated with both rough oxide-coated polysilicon and smooth, oxide-free single crystal silicon. The polysilicon devices show dramatically reduced process stiction as a result of the surface roughness, enabling higher yield on more compliant structures. In-use stiction is slightly higher for the...
Smaller footprint, thinner packages and simultaneously increased functionality are general requests for all electronic products and as well hold true for MEMS sensors. Current standard packaging technology for MEMS sensors is stacking the ASIC and MEMS silicon dies on a substrate. The sensitive dies are then either protected by over-molding or by attaching some sort of lid. Typical substrate materials...
In this paper we present a new approach for building specific packaging that is scalable, versatile and could be potentially cost competitive. Using polymer additive manufacturing, more commonly known as 3D printing, we set out to build customized structures and packages perfectly adapted to component dimensions and specifications. Two different 3D printing technologies, respectively called stereolithography...
In our digital world, microelectromechanical system (MEMS) are here to stay and will open the doors for the next exciting wave in the advancement of technology such as the Internet of Things (IoT). The MEMS devices in wafer forms are fabricated in minute details and eventually singulated into individual units to act as sensing or actuation elements in various applications such as accelerometer and...
A MEMS-based gas chromatograph (GC) front-end for a mass spectrometer has been developed for space applications. The GC uses Molecular Vapor Deposition (MVD) to achieve a uniform coating of the GC column. Particular attention has been paid to the fluidic connections of the MEMS to the external tubing.
Quartz due to its piezoelectricity and its good temperature stability is one of the most used materials in devices for time-frequency applications. Quartz resonators are generally obtained by chemical etching or chemical mechanical polishing but these two methods do not allow the shrinking of the dimensions of the devices and limit reachable geometry: in particular structures with high aspect ratios...
This paper presents a finite element analysis of die attach packaging stress effect on emerging nanomechanical silicon optical filters. The proposed silicon optical filter is composed of Si waveguides and a microring resonator having a few hundred nm in thickness and a few tens of μm in length. Photonic integrated circuit is typically implemented by attaching a new component to a common ceramic interposer...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.