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In the past several decades on-chip dimensions have scaled over 2000X, while dimensions on printed circuit board have scaled 4-5X. This modest scaling of packaging dimensions has severely limited system scaling. To address this, we have proposed a disruptive package-free integration scheme. We replace the traditional organic printed circuit board (PCB) with silicon interconnect fabric (SiIF) and replace...
This paper gives a general overview on the methods to reduce interconnect resistance and capacitance in a standard CMOS technology followed by a discussion on the physical constraints that dictate the minimum achievable loading. A newly demonstrated method that uses carbon-nanotube to assist the formation of vertically aligned porous structure is studied. The method was shown to be able to reduce...
A method for interactive initial placement of Integrated Circuits (IC's) cells is provided. The method is based on multi-parameter criterion placement with customizable coefficients of importance for private criterion together with simulation of thermal field of IC substrate. Graphical user interface (GUI) is provided for thermal field modeling, equipped with a set of abilities for designing which...
In this paper, the delamination behavior of an end-linked PDMS/copper interface is investigated through molecular dynamics simulations. A stepwise end-linking protocol based on an iterative MD simulation/energy minimization is utilized to develop the post-cured microstructure of the PDMS. Stress versus strain relation is calculated to understand the PDMS/copper interfacial tensile strength and thus...
In this paper, silicon/glass/organic interposers for 2.5D/3D interconnects are investigated for signal integrity analysis. As total system bandwidth increases, memory industry has been developed to satisfy its requirements. Therefore, High Bandwidth Memory (HBM) is introduced to the market. HBM enables TeraByte/s bandwidth with extremely fine pitch, short interconnects using Through Silicon Via (TSV)...
This paper presents a research focused on Aerosol Jet interconnecting of SMD components to flexible substrates. Flexible printed electronics is becoming important fast growing market segment. Contacting technologies of the electronic components are well known for traditional electronics such as soldering, welding, conductive adhesive bonding, however in the expansion of direct printing technologies...
The tremendous growth in smartphones and tablets has been fueled by consumer demand for increased mobility, functionality, and ease of use. This, in turn, has been driving an increase in functional convergence and 3D integration of integrated circuit (IC) devices, resulting in the need for more advanced and sophisticated packaging techniques. In particular, the integration of the application processor...
In this paper, the interconnection between two sections of Air-Filled Substrate Integrated Waveguide (AFSIW) transmission line is presented. AFSIW is of high interest for high performance and low-cost millimeter wave applications. It is based on multilayer Printed Circuit Board (PCB) process. For system prototyping and assembly, it is common to interconnect components and sub-circuits. However, to...
FOG(Flexible Printed Circuit On Glass) ACF(Anisotropic Conductive Film) bonding achieves electric conductivity interconnection by ACF material. The conductive microspheres from ACF material are trapped between ITO(Indium Tin Oxides) bumps and substrate pads, which are the fundamental cause of achieving electric conductivity interconnection. Prior work has studied the mechanism of achieving electric...
Simulation of the electromagnetic fields radiated from high speed printed circuits is becoming increasingly important in system design as well as to ensure compliance with present electromagnetic compatibility standards. In this paper electromagnetic radiation due to high speed signals on printed circuit board, multi-chip module, and integrated circuit interconnects is examined using a simple closed...
Due to the increasing demand for higher performance, greater flexibility, smaller size, and lighter weight in mobile electronic products, there have been growing needs of wearable electronic products in near future. Wearable watches, glasses, wrist bands, shoes, and clothes have been recently introduced in the market.
To achieve better vision through a retinal prosthesis, over 1000 electrodes are preferable. When increasing the number of electrodes, we may be faced a critical issue associated with the interconnection of stimulus electrodes and lead wires with good mechanical flexibility. To access the issue, we have proposed and developed a smart electrode that consists of a stimulus electrode combined with a CMOS...
This paper describes the microfabrication, assembly and preliminary characterization of a flexible multi-layer circuit wrapped around a base plate utilized as a high-throughput 48-well Microelectrode Array (MEA) device. Roll to roll flexible circuit technology allows for fine lines and spaces (<25 μm) to be fabricated in a large area fashion and has been exploited for the first time to our knowledge...
We propose a new hybrid structure of the substrate for fabricating stretchable electronic circuits, which provides well-controlled wavy and stretchable regions for interconnects and flat and rigid areas for active devices, respectively. In this technique, the thick-and-flat polyimide islands for active devices are formed within a thin-and-wavy parylene region for stretchable interconnects, so that...
The continuous requirement of higher communication bandwidths in data centers or high performance computers drives the convergence between ASICs and optical I/Os. Combining 3D integration and Si-photonic technologies on a photonic interposer platform would offer tremendous opportunities for performance improvement assuming that 3D electrical paths are efficiently managed. Routing strategies for die-to-die...
Metalized micron scale polymer particles have been utilised in anisotropically conductive adhesives for a number of years and more recent work has investigated their selective deposition to provide interconnects. In this work such particles have successfully been deposited onto substrates that included both unpatterned Cr/Au coated chips and test chips with “daisy-chain” interconnected bond pads,...
In an industry which demands for continuous innovation and perfection, we are constantly deriving new processes and solutions to break the technological limits which will set us apart. We are striving to achieve denser integrated circuits for better performance as Moore's law perceives and also redefining the word, “Thin”. Driven by cost and in order to achieve thinner IC packages, we have created...
Conformable electronic systems consisting of laterally distributed electronic components (typically sensors, actuators or LEDs) have attracted considerable interest during the last years. By using different technology approaches considerable elasticity, repeated stretchability and conformability of such systems has been shown by research groups. Contrary to the expression of interest by many potential...
Three-dimensional (3D) field-effect transistors (FETs) such as FinFETs and nanowire FETs are device structures for extremely scaled FETs. However, the thermal properties of 3D FETs become worse than those of conventional planar MOSFETs. As a result, an increase in channel temperature during operation, which is called self-heating effects (SHEs) is prominent in nanoscale devices. In this work, 1) SHEs...
Emerging flexible hybrid electronics paradigm integrates traditional rigid integrated circuits and printed electronics on a flexible substrate. This hybrid approach aims to combine the physical benefits of flexible electronics with the computational advantages of the silicon technology. In this paper, we discuss the possibility to implement a physically flexible system capable of sensing, computation...
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