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Increasing I/O counts have led to ever decreasing cross sectional contact areas or, by default, an increase in solder performance expectations. A recognized measure of solder joint integrity is gained through High Speed Shear testing, (HSS). This article will statistically evaluate the solderability of the dominant final finishes with reference to some real life variables. The only skew is that only...
The main problems with plasmonics for devices are connected with its very nature implying the need to use free electron conductors, mostly good metals like silver or gold. The choice of natural materials and thus their operating ranges, as defined by their plasma frequency, is rather limited. Also, absorption losses in good conductors are quite high. Because of that alternative plasmonic materials...
Recently, high density integrated circuits are packaged in the electronic devices such as smartphones and smartwatches. Power amplifier modules integrated in such devices interact with other circuits due to its inductive components, and may cause the electromagnetic interference issues. To reduce the electromagnetic issues, sputtering technology can be used. In this paper, we present the shielding...
For a limited solder volume interconnect structure, bump interconnect reliability is more sensitive to the growth behavior of the interfacial intermetallic compounds(IMCs). The study of the effect of solder cap thickness on the interfacial diffusion reaction is of great importance to the application of copper pillar bump. Here, we investigated the effect of different solder cap thicknesses on IMCs...
Wafer level package (WLP) sample is one of the most popular packaged methods due to its low cost (wafer batch process), high performance, small form factor and low assembly cost [1]. Decapsulation is necessary for failure analysis. Fig. 1 and Fig. 2 are the sketch maps of the WLP wafer with Sn balls on the chip. The stannum (Sn) ball on the package need be removed while the copper line (Re-distribution...
This paper presents the relations between processing, microstructure and mechanical reliability of copper pillar bumps (CuPi). Two sets of samples were manufactured: Cu/SnAg and Cu/Ni/SnAg with diameters between 15 and 20 µm. From the microstructure point of view: at these dimensions and for simulated reflows, up to 5, intermetallic compounds (IMC) follow a classical power law with a time exponent...
This work presents the thermal reliability test results of a metaconductor device on a glass substrate. Custom thermal cycling testing between room temperature and 100 °C has been performed for both Cu/Ni and Cu/NiFe metaconductor based transmission lines. The overall electrical performance has been well preserved between 300 kHz and 12 GHz. After a high temperature annealing treatment with 400 °C...
Package delamination is a common problem in electronic packaging, and this study focused on the low-profile fine-pitch ball grid array (LFBGA) and plastic ball grid array (PBGA) package of composite and metal bonding and bonding mechanism to decrease the occurrence of delamination. In LFBGA, the physical and chemical properties were discussed by roughness and pure copper/nickel bonding experiment...
In this paper, the impact of a layered surface model on the results of a CST Microwave Studio simulation is analyzed. Objective of this research is to closely match simulation results to measurements. For the comparison, a microstrip line is processed at Euro circuits with a nickel-gold surface finish (ENIG).
Recently, copper wires have been attracting much attention for LSI (Large Scale Integration) bonding because of its excellent mechanical and electrical properties, and low material cost. On the other hand, the end of these wires are usually joined to the pads or through-holes on the printed circuit board, and lead-free soldering is one of the popular bonding methods. Since the solders are weaker than...
A possible strategy for the characterization of grown-in and processing-induced electrically active point and extended defects in high-mobility substrates is presented and illustrated by examples obtained on Ge as a prototype system.
A novel low-temperature, pressureless bonding approach by electroless plating with controlled flow through a microfluidic device, in which a laminar forced convection flow of electroless solution was passing through a microchannel between dies and to gaps between copper pillars, was developed to metallically interconnect copper pillars together. Previous study had been demonstrated that, with the...
Conformal plating on mold compound is a new fabrication process technology, it offers new possibility for IC package design to improve features such as rigidization of the flexible core, heat sinking, 3D circuit patterning and EMI shielding. This fabrication technology had successfully demostrated a process which is able to achieve high reliable performance, as being proven to have high peeling strength...
Low-temperature low-pressure silver sintering is a die attachment process for highly reliable power modules. The quality of the sintered interconnection strongly depends on the properties of substrate metal, the die metallization and the sinter paste. This paper investigates the properties of chips sintered at 10 MPa and 250 °C on recently proposed gold layers, which are electrochemically deposited...
Spark Plasma Sintering (SPS) is normally carried out to obtain consolidated materials of low residual porosity. SPS can also be used for the preparation of partially densified (porous) materials. Partial densification is achieved during SPS by using relatively low sintering temperatures or pressureless conditions. For a pressureless assembly, short punches are used; in addition, sintering without...
As the advancement of transistor nodes faces unprecedented challenges and work continues to extend Moore's law at the back end of the line (BEOL), packaging has become one of the fastest growing segments in the semiconductor industry. Lead-free soldering is one of the most critical steps in interconnection at the packaging level. The evolution of packaging requirements for various devices is driving...
The finer pitch of 10 µm and below is currently explored by Microdisplays and Imaging industries. There are many contenders for achieving assembly at this pitch e.g. Cu-diffusion, Microtubes[1], and SnAg bumps. Among the contenders, SnAg bumps are tested for larger bumps but their capabilities for the finer pitch are yet to be explored. In this paper, behavior of SnAg for smaller bumps for the finer...
A literature overview, up to the end of 2004, of the most important microwave-assisted transition-metal-mediated processes used for the decoration and construction of heterocycles is presented. The emphasis of the chapter lies in the use of palladium-assisted reactions but examples of copper- and nickel-mediated processes are also incorporated.
High bonding temperature and force are known to cause physical damage to the device. The objective of this present study is to develop a new low-temperature and pressureless bonding method for Cu-to-Cu interconnects using electroless Ni plating. Two plating methods were employed to test the feasibility of electroless bonding of copper pillars. The first method was carried out in a stirred plating...
A statistical method to determine key control-factors for synthesis of Graphene on Copper (Cu) using amorphous carbon (a-C) as the solid carbon source is demonstrated in this work. Attribute-Response Factorial Design-of-Experiments (DoE) are analyzed in order to accurately determine the key control-factors. Temperature and a-C thickness are found to be the important controlling factors. The outcome...
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